Capacitor External Electrode Plating Prevention for Mounting Density
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Solution Overview
Problem
The challenge in miniaturizing multilayer ceramic electronic components is to achieve thinness and high capacitance while reducing the mounting area, as conventional methods lead to non-uniform external electrode thickness and increased plating defects, limiting the size and reliability of capacitors.
Innovation Solution
A capacitor design featuring a body with alternately disposed internal electrodes and external electrodes formed with thin, uniform thickness using a sheet transfer method, along with a plating prevention member to prevent solder attachment on the end surfaces, reducing the mounting area and improving density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external electrodes are formed to extend to end surfaces for electrical connection, then electrical connectivity is improved, but solder may attach to end surfaces increasing mounting area
Solution Approach 1:
The external electrode is segmented into two distinct parts: a body electrode portion on the main body surface and an extension portion on the end surface. The plating prevention member further segments the surface by creating a non-plating region on the end surface, separating the electrical connection function from the solder attachment function.
Solution Approach 2:
A plating prevention member is introduced as an intermediary substance between the extension portion and the plating solution. This intermediary prevents solder plating from forming on the end surface while allowing the extension portion to maintain its electrical connection function.
2Quantity of substance
If dielectric layer thickness is reduced to increase capacitance, then capacitance increases, but manufacturing precision requirements worsen
Solution Approach 1:
The patent changes the thickness parameter of the dielectric layer to achieve higher capacitance. By optimizing the dielectric material composition and controlling the thinning process parameters, the patent achieves uniform thin dielectric layers with improved capacitance while maintaining acceptable manufacturing precision through controlled parameter variations.
3Area of stationary object
If external electrode thickness is reduced to minimize mounting area, then mounting density improves, but electrode reliability worsens
Solution Approach 1:
The patent applies different quality requirements to different parts of the external electrode. The body electrode portion maintains sufficient thickness for reliability, while the extension portion can be thinner since it only needs to provide electrical connection, not mechanical strength. This local differentiation allows overall size reduction without compromising electrode reliability.
Data Source
AI summary
A capacitor includes a body including a dielectric layer and a plurality of first and second internal electrodes which are alternately disposed while having the dielectric layer therebetween, including first to sixth surfaces; a first external electrode disposed on the third surface and including a first extension portion extending from the third surface to portions of the first, second, fifth, and sixth surfaces, adjacent to the third surface; a second external electrode disposed on the fourth surface and including a second extension portion extending from the fourth surface to portions of the first, second, fifth, and sixth surfaces, adjacent to the fourth surface; and a plating prevention member covering the first and second extension portions disposed on the fifth surface and the sixth surface.