Solid Electrolytic Capacitor With Recessed Insulating Substrate
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Solution Overview
Problem
Conventional solid electrolytic capacitors are prone to bending and internal electrical connection defects due to thermal and mechanical stresses during mounting on a wiring substrate, leading to electrical connection failures between electrode leads and connection members.
Innovation Solution
A solid electrolytic capacitor design featuring an insulating substrate with a step portion, including a recessed surface and a projected surface, where the exterior body material is placed within the recessed surface to absorb stress and increase adhesion between the capacitor element and the substrate, and the electrode lead-out structures are configured to maintain electrical connections despite the step portion, ensuring the capacitor element and substrate are securely attached and less likely to bend.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a flat insulating substrate is used, then the manufacturing process is simple, but the capacitor is prone to bending and internal electrical connection defects during mounting
Solution Approach 1:
The insulating substrate is designed with a step portion that creates local thickness variation. The first region has a greater thickness than the second region, providing localized reinforcement at critical areas while maintaining overall structural integrity. This local quality change allows the substrate to resist bending stresses during mounting without requiring complete redesign of the entire substrate structure.
2Reliability
If the exterior body material is placed within the recessed surface, then thermal and mechanical stresses are absorbed, but the device structure becomes more complex
Solution Approach 1:
The step portion is pre-formed on the insulating substrate before final assembly. This preliminary structural preparation creates the recessed surface and projected surface features that will later receive and accommodate the exterior body material, allowing the material to be positioned precisely within the recessed area for optimal stress absorption.
Solution Approach 2:
The invention transitions from a two-dimensional flat substrate to a three-dimensional structure with varying thickness. The step portion introduces a vertical dimension difference, creating distinct first and second regions with different thicknesses. This dimensional change provides additional space for stress absorption while maintaining a compact overall form factor.
3Ease of manufacture
If the insulating substrate has uniform thickness, then manufacturing is easier, but adhesion between capacitor element and substrate is insufficient
Solution Approach 1:
The insulating substrate is designed with a step portion that creates local thickness variation. The first region has a greater thickness than the second region, providing localized reinforcement at critical areas while maintaining overall structural integrity. This local quality change allows the substrate to resist bending stresses during mounting without requiring complete redesign of the entire substrate structure.
Data Source
AI summary
A solid electrolytic capacitor comprises insulating substrate having an upper surface and a lower surface, a capacitor element disposed on the upper surface, a positive electrode lead-out structure, a negative electrode lead-out structure, and an exterior body configured to cover the capacitor element on the upper surface. The capacitor element has a positive electrode member, a negative electrode member, and a dielectric member. The positive electrode lead-out structure has a positive electrode terminal formed on the lower surface of the insulating substrate and is electrically connected to the positive electrode member. The negative electrode lead-out structure has a negative electrode terminal formed on the lower surface of the insulating substrate and is electrically connected to the negative electrode member. The insulating substrate has a step portion made up of a recessed surface formed by recessing the upper surface and a projected surface formed by projecting the lower surface.