Capacitor Module Relay Substrate Heat Dissipation
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Solution Overview
Problem
Conventional capacitor configurations face challenges in efficiently connecting lead wires to external connectors without damaging the capacitor due to high heat generated during soldering, which prolongs the soldering process and risks capacitor damage.
Innovation Solution
A capacitor module design that includes a capacitor, a relay substrate, and connection terminal members, where the lead wires are connected to conductive patterns on the substrate, allowing for easier and faster soldering while minimizing heat transfer to the capacitor, using bus bars and harnesses to connect to external connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lead wires are directly soldered to terminal members connected to terminal plates, then electrical connection is achieved, but heat damages the capacitor during soldering
Solution Approach 1:
A relay substrate is introduced as an intermediary component between the capacitor's lead wires and the terminal plate. The lead wires are soldered to conductive patterns on the relay substrate, which then connects to terminal members. This intermediary structure allows soldering to occur on the substrate rather than directly at the capacitor, reducing heat damage to the capacitor while maintaining electrical connection.
2Productivity
If lead wires are directly soldered to terminal members, then assembly is simplified, but soldering time increases and heat damage risk increases
Solution Approach 1:
The connection structure is segmented into multiple functional parts: the capacitor body, the relay substrate with conductive patterns, terminal members, and connection terminal members. This segmentation allows the soldering process to be performed on the relay substrate which has better heat dissipation characteristics, reducing the risk of capacitor damage while maintaining efficient assembly through standardized connection interfaces.
3Device complexity
If conventional direct soldering is used, then device complexity is reduced, but heat transfer to capacitor increases
Solution Approach 1:
The relay substrate serves as a thermal intermediary that separates the heat source (soldering iron) from the capacitor. The conductive patterns on the substrate provide a controlled thermal path that dissipates heat away from the capacitor body, reducing temperature rise and preventing damage while maintaining a relatively simple overall structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables efficient electrical connection of lead wire type capacitors to external connectors while preventing heat damage, reducing assembly time and ensuring precise positioning of components, thus enhancing reliability and safety.
Implementation Method 1
The first conductive pattern is electrically connected with the first lead wire. The second conductive pattern is electrically connected with the second lead wire.
Implementation Method 2
the pair of lead wires are soldered to a conductive pattern formed on the printed board
Data Source
AI summary
The capacitor module includes a capacitor, a relay substrate, a first connection terminal member, and a second connection terminal member. The capacitor includes a capacitor body, a first lead wire, and a second lead wire. The first lead wire and the second lead wire are drawn out from the capacitor body. The relay substrate includes a first conductive pattern and a second conductive pattern. The first conductive pattern is electrically connected with the first lead wire. And the second conductive pattern is electrically connected with the second lead wire. The first connection terminal member is electrically connected to the first conductive pattern. The first connection terminal member includes a first terminal part configured to be electrically connected to an external connector. The second connection terminal member is electrically connected to the second conductive pattern. The second connection terminal member includes a second terminal part configured to be electrically connected to an external connector.