Multi-Layer Capacitor Using Removable Spacer Air Gaps
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Solution Overview
Problem
High-frequency capacitors face challenges in maintaining quality due to increasing internal equivalent series resistance (ESR) and dielectric constant changes with frequency, limiting their use in millimeter wave spectrum applications, and conventional dielectrics introduce inductance and resistance issues with lead connections.
Innovation Solution
A multi-layer capacitor design with electrodes spaced by removable spacers filled with air, gas, or vacuum, bonded together and encapsulated, maintaining constant dielectric constant and reducing ESR, while allowing exposed conducting surfaces for electrical coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional dielectric materials are used in capacitors, then the capacitor can be constructed with standard materials and processes, but the internal equivalent series resistance (ESR) increases significantly and dielectric constant changes as frequency increases to millimeter wave spectrum
Solution Approach 1:
The patent extracts and removes the conventional dielectric material from between the capacitor electrodes, replacing it with a vacuum or air gap. This eliminates the dielectric material's frequency-dependent ESR and dielectric constant changes, allowing the capacitor to maintain stable performance across millimeter wave frequencies while using standard construction processes.
2Reliability
If air, gas or vacuum is used as dielectric, then the capacitor approaches theoretical performance with constant dielectric constant and low ESR, but the capacitor requires increased electrode spacing to withstand high working voltages, increasing physical size
Solution Approach 1:
The patent changes the dielectric parameter from material-based (conventional dielectrics) to vacuum/air-based, which fundamentally alters the electric field distribution and breakdown characteristics. This parameter change enables the capacitor to achieve theoretical performance with reduced ESR and constant dielectric constant, while the electrode spacing is optimized to balance voltage withstanding capability and compact size.
3Ease of operation
If lead connections with wire length or end cap attachment are used, then the capacitor can be connected to circuit board, but significant inductance and series circuit resistance are introduced
Solution Approach 1:
The patent extracts and eliminates the traditional lead connection structure (wire leads and end caps) from the capacitor design. Instead, it employs direct mounting techniques where the capacitor electrodes are soldered or bonded directly to the circuit board traces, removing the parasitic inductance and resistance associated with lead connections while simplifying the overall device structure.
Data Source
AI summary
An electronic component and method for manufacture thereof is disclosed. A plurality of electrodes are positioned in stacked relation to form an electrode stack. The stack may include as few as two electrodes, but more may be used depending on the number of subcomponents desired. Spacing between adjacent electrodes is determined by removable spacers during fabrication. The resulting space between adjacent electrodes is substantially filled with gaseous matter, which may be an actual gaseous fill, air, or a reduced pressure gas formed through evacuation of the space. Further, adjacent electrodes are bonded together to maintain the spacing. A casing is formed to encapsulate the stack, with first and second conducting surfaces remaining exposed outside the casing. The first conducting surface is electrically coupled to a first of the electrodes, and the second conducting surface is electrically coupled to a second of the electrodes.