Capacitor Securing Apparatus for Power Semiconductor Bus Bar

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Solution Overview

Problem

Existing power semiconductor devices subject capacitors to severe mechanical loading, leading to potential damage and require time-consuming and error-prone foam element placement during production.

Innovation Solution

Incorporating an elastic deformation element made from an elastomer, materially bonded to the capacitor securing apparatus, which presses the DC voltage bus bar system against the substrate, reducing mechanical loading on capacitors and simplifying production by eliminating the need for foam elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If foam elements are used to press the bus bar system terminal elements against the substrate, then the capacitors are subjected to severe mechanical loading, but the electrical connection is achieved

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidmechanical loading on capacitors
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The harmful foam elements are completely removed from the system. The patent replaces the foam element-based pressing mechanism with a direct mechanical pressing structure that eliminates the need for foam elements, thereby removing the source of mechanical loading on the capacitors while maintaining the electrical connection function.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces a pressing structure as an intermediary mechanism between the capacitor securing apparatus and the bus bar system terminal elements. This pressing structure directly transmits the pressing force to the terminal elements without involving foam elements, thereby achieving reliable electrical connection while avoiding excessive mechanical loading on the capacitors.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If foam elements are placed between blocking elements and capacitors during production, then the assembly is completed, but the process is time-consuming and error-prone

Engineering Contradiction:
Improveassembly completionVSAvoidproduction time
Core Design Contradiction:
Ease of manufactureVSLoss of time

Solution Approach 1:

The foam elements are completely removed from the assembly process. The patent replaces the multi-step process of placing foam elements with a direct mechanical pressing structure that integrates the pressing function into the capacitor securing apparatus, thereby eliminating the time-consuming and error-prone foam element placement step.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The pressing structure is designed to automatically perform the pressing function when the capacitor securing apparatus is installed. The structure self-activates to press the bus bar system terminal elements against the substrate without requiring separate intervention to place foam elements, thereby streamlining the production process.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces mechanical stress on capacitors, enhancing their longevity and streamlining the production process by ensuring reliable and efficient assembly without the risk of missing foam elements.

Implementation Method 1

at least one elastic first deformation element which is materially bonded to the capacitor securing apparatus and is formed from an elastomer is arranged on the side of the capacitor securing apparatus facing the DC voltage bus bar system, wherein the power semiconductor device is embodied in such a way that the capacitor securing apparatus, via the at least one first deformation element, presses the DC voltage bus bar system in the direction of the substrate

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS10141247B2Power semiconductor device
Publication Date: 2018.11.27 SEMIKRON DANFOSS ELEKTRONIK GMBH & CO KG
  • US10141247B2 patent drawing
  • US10141247B2 patent drawing
  • US10141247B2 patent drawing

AI summary

The invention relates to a power semiconductor device with a substrate and an electrically conductive DC voltage bus bar system and a capacitor connected to the bus bar system, wherein the power semiconductor device has, for securing the capacitor, a capacitor securing apparatus comprising a receptacle device for receiving the capacitor, in which at least part of the capacitor is arranged. Electrically conductive bus bar system terminal elements are electrically connected thereto and run in the direction of the substrate. An elastic first deformation element is materially bonded to the capacitor securing apparatus and is formed from an elastomer is arranged on the side of the capacitor securing apparatus facing the DC voltage bus bar system. The device is embodied in such a way that the capacitor securing apparatus, via the deformation element, presses the DC voltage bus bar system in the direction of the substrate and thereby presses the bus bar system terminal elements against electrically conductive contact areas of the substrate such that the bus bar system terminal elements are electrically conductively pressure-contacted with said contact areas of the substrate.