Capacitor Structure With Segmented Electrodes And High-k Dielectric
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Solution Overview
Problem
Current semiconductor capacitor structures lack innovative designs that enhance performance and efficiency, particularly in terms of electrode arrangement and dielectric materials, leading to limitations in capacitance and integration density.
Innovation Solution
The proposed semiconductor capacitor structure features a configuration of conductive plates with alternating electrodes, where first and second conductive strips are electrically coupled through conductive vias, with specific arrangements to minimize pitch and maximize parallel alignment, and the use of high-k dielectric materials for improved capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional capacitor structures are used, then manufacturing is simpler, but capacitance density and integration efficiency are limited
Solution Approach 1:
The capacitor electrode is divided into multiple conductive strips arranged in parallel, with each strip contributing to the overall capacitance. This segmentation allows the capacitor to achieve higher capacitance density by utilizing multiple parallel conduction paths while maintaining a compact structure that can be integrated into semiconductor devices.
Solution Approach 2:
The invention transitions from conventional planar capacitor structures to a three-dimensional arrangement where conductive strips are stacked vertically and connected through conductive vias. This dimensional change enables increased capacitance density by utilizing vertical space, effectively multiplying the effective electrode area without increasing the planar footprint.
2Productivity
If pitch is minimized for higher integration, then integration density improves, but manufacturing precision requirements increase
Solution Approach 1:
Adjacent conductive strips from different capacitor structures are merged and electrically connected through shared conductive vias. This merging approach allows multiple capacitor elements to share common conductive pathways, reducing the overall pitch requirements and increasing integration density while distributing the manufacturing precision requirements across multiple shared structures.
Solution Approach 2:
The conductive vias serve multiple functions: they connect adjacent conductive strips, provide electrical pathways for multiple capacitor elements, and act as structural support. This multi-functionality reduces the number of separate components needed, allowing for tighter pitch and higher integration density without proportionally increasing manufacturing complexity.
3Quantity of substance
If high-k dielectric materials are used, then capacitance improves, but material selection and processing complexity increase
Solution Approach 1:
The invention changes the dielectric constant parameter by utilizing high-k dielectric materials instead of conventional low-k materials. This parameter change directly increases the capacitance value for a given physical structure. The conductive strip and via configuration is optimized to work synergistically with the high-k material properties, maximizing capacitance while managing the increased material processing requirements through standardized fabrication techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances capacitance density and integration efficiency by optimizing electrode arrangement and dielectric material usage, addressing the limitations of existing capacitor structures.
Implementation Method 1
the use of high-k dielectric materials for improved capacitance
Data Source
AI summary
One or more embodiments are related to a semiconductor chip comprising a capacitor, the capacitor comprising: a plurality of conductive plates, each of the plates including a first conductive strip and a second conductive strip disposed over or under the first conductive strip, the second conductive strip of each plate being substantially parallel to the first conductive strip of the same plate, the second conductive strip of each plate electrically coupled to the first conductive strip of the plate through at least one conductive via, the second conductive strips of each group of at least two consecutive plates being spaced apart from each other in a direction along the length of the plates.