Capacitor Assembly with Silver Sintering Base
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Solution Overview
Problem
Ceramic multilayer capacitors require a connection technology to printed circuit boards that offers high electrical and thermal conductivity with low inductance, while minimizing structural space and maintaining functionality across temperature changes.
Innovation Solution
A capacitor assembly comprising a ceramic multilayer capacitor mechanically and electrically connected to a base with silver sintering, which is then surface-mounted on a printed circuit board, ensuring a large-area connection with low inductance and high thermal conductivity, and featuring a base with adapted thermal expansion coefficients to reduce mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the multilayer capacitor is connected to the printed circuit board using conventional connection technology, then the structural space required is reduced, but the electrical and thermal conductivity deteriorates and inductance increases
Solution Approach 1:
The base integrates multiple functions: it serves as a mechanical mounting platform, an electrical connection element through conductor tracks, and a thermal management component through the thermally conductive substrate. This merging of functions into a single base component resolves the contradiction by providing high electrical and thermal conductivity without requiring additional separate connection structures, thereby maintaining low device complexity.
Solution Approach 2:
The base is designed as a multi-functional component that simultaneously provides mechanical support, electrical connection via conductor tracks, and thermal conduction through the substrate. This universal design allows a single component to address multiple requirements (electrical conductivity, thermal conductivity, mechanical mounting) without increasing overall system complexity, thus resolving the technical contradiction.
2Reliability
If the connection area between the capacitor and printed circuit board is increased to improve conductivity, then the electrical and thermal conductivity improves, but the structural space occupied increases
Solution Approach 1:
The base employs local quality optimization by concentrating high thermal and electrical conductivity properties in specific regions: the substrate provides thermal conduction pathways, while conductor tracks provide electrical conduction pathways. This localized optimization allows high conductivity without requiring a uniformly large connection area, thus resolving the contradiction between conductivity and structural space.
Solution Approach 2:
The base uses composite construction combining a thermally conductive substrate material with highly conductive conductor track materials. This composite approach enables high electrical and thermal conductivity within a compact footprint by strategically placing different conductive materials where needed, avoiding the need for a large overall connection area.
3Productivity
If the capacitor assembly is designed for high current-carrying capacity at high frequencies, then the charge take-up capacity improves, but the parasitic inductance increases
Solution Approach 1:
The base divides the electrical connection path into multiple parallel conductor tracks that lead from the top side to the underside of the substrate. This segmentation of the current path into multiple parallel pathways reduces the loop area and minimizes parasitic inductance, enabling high current-carrying capacity at high frequencies without sacrificing charge take-up capacity.
4Reliability
If the capacitor must remain functional under large temperature changes, then the thermal stability improves, but the mechanical stress increases
Solution Approach 1:
The substrate material is selected and designed with specific thermal and mechanical parameters optimized for thermal shock resistance. By changing the material parameters (thermal conductivity, coefficient of thermal expansion, mechanical strength) of the substrate, the base can withstand large temperature changes while maintaining functional reliability and minimizing mechanical stress on the capacitor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a stable, high-capacity connection with low electrical losses and efficient heat dissipation, meeting stringent thermomechanical requirements and minimizing structural space, while maintaining reliability and conductivity.
Implementation Method 1
the base can bear by a large area on the printed circuit board, such that a good thermal conductivity is also present between the base and the printed circuit board. Accordingly, heat that arises in the capacitor during operation can be dissipated to the printed circuit board via the base
Implementation Method 2
A capacitor assembly comprising a ceramic multilayer capacitor mechanically and electrically connected to a base with silver sintering, which ensures a large-area connection with low inductance and high thermal conductivity
Data Source
AI summary
The present invention relates to a capacitor assembly (1) which comprises at least one ceramic multilayer capacitor (2) comprising ceramic layers (4) and first and second electrodes (5a, 5b) arranged therebetween, and a base (3). The base (3) comprises a substrate (9) and conductor tracks (10a, 10b), wherein the conductor tracks (10a, 10b) lead from a top side (11) of the substrate (9) said top side facing toward the multilayer capacitor (2), to an underside (12) of the substrate (9), said underside facing away from the multilayer capacitor (2). The multilayer capacitor (2) is mechanically secured on the base (3). The first electrodes (5a) and the second electrodes (5c) are electrically contacted with the conductor tracks (10a, 10b).