Multilayer Capacitor Solder Terminals Vibration Damping
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Solution Overview
Problem
Multilayer electronic components, such as capacitors, generate acoustic noise and high-frequency vibrations due to piezoelectric properties, which can lead to device malfunctions and noise interference, especially when operated in silent environments or in devices with audio circuits.
Innovation Solution
The design incorporates a multilayer electronic component with a capacitor body having dielectric layers and internal electrodes, along with external electrodes and connection terminals that include solder accommodating portions to reduce vibration transfer, using conductive resin layers and specific terminal geometries to absorb and trap solder fillets, thereby minimizing acoustic noise and high-frequency vibrations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the volume and height of the solders are increased to improve connection reliability, then the solder joint strength is improved, but the vibrations of the multilayer capacitor are more easily transferred to the circuit board, increasing the magnitude of acoustic noise
Solution Approach 1:
The patent introduces a damping material layer between the multilayer capacitor and the circuit board as an intermediary element. This damping layer absorbs and dissipates vibrations, preventing them from being transmitted to the circuit board while still allowing the solders to provide strong mechanical connection. The damping material acts as a mediator that decouples the vibration transfer path while maintaining electrical and mechanical connectivity.
Solution Approach 2:
The patent converts the harmful piezoelectric vibrations generated by the capacitor into beneficial damping effects by using the solder joints and damping materials to absorb and dissipate the vibration energy. The solders, which could potentially transmit vibrations, are designed with specific geometry and material properties to act as vibration dampers, transforming the harmful vibration transmission into beneficial vibration absorption and energy dissipation.
2Ease of manufacture
If the solders are formed in an inclined state at predetermined height on surfaces of the external electrodes to ensure proper soldering, then the ease of soldering is improved, but the vibrations are more easily transferred to the circuit board
Solution Approach 1:
The patent applies different properties to different parts of the solder joint structure. The solders are formed with an inclined state at predetermined heights on the external electrode surfaces to facilitate easy soldering and proper wetting. However, the lower portion of the solder joints that contacts the circuit board is designed with different geometry and material characteristics to minimize vibration transfer. This local differentiation allows the solder joints to simultaneously provide easy manufacturability and vibration damping.
Solution Approach 2:
The solder joint structure is segmented into multiple functional zones: an upper inclined portion for easy soldering and wetting, a middle transition zone, and a lower portion for vibration damping. This segmentation allows each zone to be optimized for its specific function, with the upper portion providing ease of manufacture and the lower portion providing vibration isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces acoustic noise and high-frequency vibrations, enhancing the reliability and performance of electronic devices by suppressing piezoelectric vibrations and preventing sensor malfunctions, while maintaining the structural integrity of the component.
Implementation Method 1
a dielectric material may have a piezoelectric property causing the material to be deformed in synchronization with a voltage applied thereto
Implementation Method 2
first and second conductive resin layers formed on at least portions of surfaces of the first and second connection terminals
Data Source
AI summary
A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween. One end of each of the first and second internal electrodes extends, respectively, to a third or fourth surface of the capacitor body. First and second external electrodes respectively include first and second connected portions disposed on the third and fourth surfaces, and first and second band portions respectively extended from the first and second connected portions to portions of a first surface of the capacitor body. A first connection terminal is disposed on the first band portion to provide a first solder accommodating portion, and a second connection terminal is disposed on the second band portion to provide a second solder accommodating portion.