Multilayer Capacitor Terminal Design for Acoustic Noise Reduction
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Solution Overview
Problem
Multilayer capacitors generate acoustic noise and high-frequency vibrations that can be perceived as malfunctions in quiet environments and degrade voice output quality, and these vibrations can interfere with sensors in IT and industrial fields.
Innovation Solution
A multilayer electronic component design with a capacitor body and connection terminal featuring specific land and band portions, and solder accommodating areas, which reduces acoustic noise and high-frequency vibrations by confining solder and absorbing vibrations through insulator land portions, thereby enhancing adhesion strength and noise reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the multilayer capacitor uses a conventional mounting structure, then the adhesion strength may be sufficient, but acoustic noise is generated in the audio frequency range and high-frequency vibrations occur at 20 kHz or more
Solution Approach 1:
A connection terminal comprising a land portion and a band portion is introduced as an intermediary component between the capacitor body and the board. This connection terminal absorbs vibrations through its elastic land portion and confines solder within recesses, thereby reducing acoustic noise transmission while maintaining adhesion strength through proper solder accommodation
Solution Approach 2:
The connection terminal's land portion is designed with specific elastic properties and geometric parameters (recess depth, width ratios between 0.2-0.5) to optimize vibration absorption. By controlling the elastic modulus and dimensions of the land portion, the structure achieves optimal balance between adhesion strength and acoustic noise reduction
2Strength
If the solder area ratio is increased to improve adhesion strength, then bonding reliability improves, but acoustic noise and high-frequency vibrations increase
Solution Approach 1:
The band portion is segmented into multiple regions including solder accommodating recesses that divide the solder distribution. This segmentation allows the solder to be distributed in controlled amounts across multiple small areas rather than one large area, reducing the overall vibration transmission while maintaining total bonding strength
Solution Approach 2:
Different regions of the connection terminal have different properties: the land portion has elastic properties for vibration absorption, while the recess portions provide localized solder confinement. The band portion transitions between these regions, creating local quality variations that optimize both adhesion and noise reduction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces acoustic noise in the audio frequency range and high-frequency vibrations, improving adhesion strength and preventing sensor malfunctions, while maintaining sufficient bonding reliability.
Implementation Method 1
the dielectric material has piezoelectricity, and can thus modified in synchronization with the applied voltage
Implementation Method 2
first and second solder accommodating portions provided by the first and second cut-out portions
Data Source
AI summary
A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal electrodes; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2≤SA1/BW1≤0.5 and 0.2≤SA2/BW2≤0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.