Connection Terminal Vibration Absorption for Ceramic Capacitors
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Solution Overview
Problem
Multilayer ceramic capacitors generate acoustic noise due to piezoelectric vibrations, which can be perceived as abnormal noise in quiet environments and degrade device quality, and high-frequency vibrations can cause malfunctions in sensors used in IT and industrial fields.
Innovation Solution
The electronic component design includes a capacitor body with external electrodes and connection terminals featuring land patterns, conductive patterns, and cut portions to absorb and redirect solder, reducing vibration transfer to the board, thereby minimizing acoustic noise across audio and high-frequency ranges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional multilayer ceramic capacitor is used, then the capacitor can store electrical energy, but acoustic noise is generated due to piezoelectric vibrations transferring to the board through solders
Solution Approach 1:
The patent introduces a connection terminal as an intermediary component between the capacitor body and the board. This connection terminal includes a vibration absorption portion that specifically targets and absorbs the piezoelectric vibrations generated by the capacitor body, preventing them from transferring to the board through the solder joints. The intermediary structure effectively decouples the vibration source from the board while maintaining electrical connectivity.
Solution Approach 2:
The patent converts the harmful piezoelectric vibrations into a beneficial effect by designing the vibration absorption portion to utilize these vibrations for damping purposes. The connection terminal structure is specifically engineered to absorb and dissipate the vibrational energy, transforming what would be harmful noise into a controlled energy dissipation mechanism that protects the board from vibration-induced issues.
2Reliability
If the capacitor body is made with piezoelectric dielectric material, then capacitance is achieved, but high-frequency vibrations of 20 kHz or more cause sensor malfunctioning
Solution Approach 1:
The connection terminal serves as a vibration isolation intermediary that protects sensitive sensors from high-frequency vibrations. The vibration absorption portion of the connection terminal is specifically designed to target and dampen high-frequency vibrations (20 kHz or more) before they can reach external sensors or cause sensor malfunctioning, while maintaining the capacitor's electrical functionality.
3Reliability
If traditional connection terminals are used, then electrical connection is achieved, but vibration transfer to the board occurs through the connection structure
Solution Approach 1:
The connection terminal is segmented into distinct functional portions: a connection portion for electrical connectivity and a vibration absorption portion for mechanical isolation. This segmentation allows the single component to simultaneously perform both electrical connection and vibration isolation functions, reducing the need for additional separate vibration damping elements and simplifying the overall assembly.
Solution Approach 2:
The connection terminal is designed as a multi-functional component that simultaneously provides electrical connection, mechanical support, and vibration absorption. By integrating multiple functions into a single component, the patent reduces device complexity while achieving effective vibration isolation, as the connection terminal structure itself serves as the vibration absorption mechanism rather than requiring separate damping components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses acoustic noise in the audio frequency range and high-frequency vibrations, preventing sensor malfunctions and internal fatigue, while improving manufacturing efficiency by shortening lead times and reducing solder height.
Implementation Method 1
Since a dielectric material of a multilayer capacitor has piezoelectric properties, the multilayer ceramic capacitor may be synchronized with an applied voltage to thereby be deformed.
Implementation Method 2
first and second connection terminals formed of an insulator, connected to the first and second external electrodes, respectively, through land patterns respectively formed on upper and lower surfaces thereof and electrically connected to each other, and having first and second bridge portions protruding so as to face each other in the length direction of the capacitor body, respectively
Data Source
AI summary
An electronic component includes: a capacitor body; first and second external electrodes disposed on a mounting surface of the capacitor body to be spaced apart from each other; and first and second connection terminals including an insulator, electrically connected to the first and second external electrodes, respectively, through land patterns each disposed on upper and lower surfaces thereof and electrically connected to each other, and having first and second bridge portions protruding so as to face each other in the length direction of the capacitor body, respectively.