Capacitor Assembly Thermal Management via Conductive Plates
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Solution Overview
Problem
High temperatures near electric motor inverters in electrified vehicles pose design and packaging challenges for DC link capacitors, which are crucial for reducing ripple current and providing reactive power.
Innovation Solution
A capacitor assembly with a film capacitor and thermal plates for direct conductive thermal communication, including a support structure with coolant channels for effective thermal management, and a radiator-style thermal plate assembly for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If DC link capacitors are placed near the inverter to reduce ripple current and provide reactive power, then the electrical performance is improved, but the capacitor is exposed to high temperatures which creates design and packaging challenges
Solution Approach 1:
A thermal plate is introduced as an intermediary component between the capacitor and the inverter. The thermal plate provides a dedicated thermal conduction path that separates the capacitor from the high-temperature inverter environment while maintaining electrical connection, thus protecting the capacitor from excessive heat exposure
Solution Approach 2:
The inverter assembly is segmented into distinct thermal zones. The capacitor is positioned in a cooler zone away from the inverter's heat-generating components, with the thermal plate creating a thermal boundary that allows the capacitor to operate in a more favorable temperature environment while maintaining functional integration
2Temperature
If thermal plates are added for direct conductive thermal communication, then thermal management is improved, but the device complexity increases
Solution Approach 1:
The thermal plate serves multiple functions simultaneously: it provides thermal conduction away from the capacitor, acts as a mounting structure for the capacitor assembly, and serves as part of the overall inverter housing structure. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity
Solution Approach 2:
The thermal management function is merged with the structural support function. The thermal plate is integrated into the inverter's existing structural framework, combining heat dissipation and mechanical support into a single unified component rather than adding separate thermal management hardware
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages thermal issues, ensuring reliable operation of capacitors in high-temperature environments and improving the efficiency of energy storage and power transfer in electrified vehicles.
Implementation Method 1
The first thermal plate is arranged for direct conductive thermal communication with the metal foils and film layers
Implementation Method 2
The support structure includes coolant channels and is arranged to orient the film capacitor assembly adjacent an inverter assembly and such that each is in conductive thermal communication with at least one of the coolant channels
Data Source
AI summary
An electrified vehicle capacitor assembly including a film capacitor assembly and a support structure is provided. The film capacitor assembly may include a stack of alternating electrodes and film layers. The electrodes may be offset from one another to alternatively contact opposing terminals. The support structure may include coolant channels and may be arranged to orient the film capacitor assembly adjacent an inverter assembly and such that each is in conductive thermal communication with at least one of the coolant channels. The film capacitor assembly further includes a stack of alternating metal foils and film layers disposed between a pair of contact layers, a pair of terminals, and a first thermal plate. Each of the pair of terminals is disposed on an outer side of one of each of the pair of contact layers.