Stacked Capacitor With Through-Hole Electrodes and Insulator Films
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Solution Overview
Problem
Conventional stacked capacitors face a challenge in achieving high withstand voltage and large capacitance without increasing their external size, as modifications to internal electrode and dielectric layers result in larger dimensions.
Innovation Solution
A capacitor forming unit with a dielectric plate having through holes, alternating electrode rods, and insulator films, allowing for a stacked capacitor configuration that maintains the same size as conventional capacitors while achieving high withstand voltage and capacitance through specific electrical connections and insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the materials and thickness of internal electrode layers and dielectric layers are changed to achieve high withstand voltage, then the rated voltage increases, but the external size increases
Solution Approach 1:
The capacitor is divided into multiple stacked capacitor forming units (first, second, third, fourth units) connected in series. Each unit contains through holes with electrode rods that are electrically connected to conductor films on dielectric plates. This segmentation allows the total capacitance to be distributed across multiple smaller units, achieving high withstand voltage through series connection while maintaining compact external dimensions.
Solution Approach 2:
Electrode rods are disposed within through holes of dielectric plates, and insulator films are formed on surface regions of the dielectric plates. The insulator films electrically insulate the electrode rods from the conductor films, creating a nested structure where multiple functional elements (electrode rods, insulator films, conductor films) are integrated within the same spatial footprint, maximizing space utilization without increasing external size.
2Quantity of substance
If the materials and thickness of internal electrode layers and dielectric layers are changed to achieve large capacitance, then the capacitance increases, but the external size increases
Solution Approach 1:
Multiple capacitor forming units are stacked and electrically connected in series to form a single capacitor device. The conductor films on adjacent dielectric plates are electrically connected, merging multiple capacitance elements into one functional unit. This combining approach achieves large total capacitance while maintaining the external size of individual stacked capacitor units.
Solution Approach 2:
The capacitor structure transitions from a planar configuration to a three-dimensional stacked configuration with through holes extending through the dielectric plates. Electrode rods are positioned within these through holes, utilizing the vertical dimension to increase effective electrode area and capacitance without increasing the horizontal footprint of the device.
Data Source
AI summary
A capacitor forming unit includes a dielectric plate, a first conductor film formed on a plate upper surface region other than front and rear end portions, a first insulator film formed on the upper surface front end portion, a second insulator film formed on the upper surface rear end portion, a second conductor film formed on a plate lower surface region other than front and rear end portion, a third insulator film formed on the front end portion lower surface, and a fourth insulator film formed on the lower surface rear end portion. One or more first electrode rods are disposed in through holes, and electrically connected to the first conductor film and electrically insulated from the second conductor film. One or more second electrode rods are disposed in other through holes, and electrically connected to the second conductor film and electrically insulated from the first conductor film.