Capacitor Component With Varying Connecting Electrode Diameters
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in increasing capacity while maintaining reliability and electrical connectivity, particularly due to limitations in reducing dielectric layer thickness and forming vias without causing delamination or cracks.
Innovation Solution
A multilayer capacitor component is designed with unit laminates of varying connecting electrode diameters, allowing for efficient stacking and separate formation of vias to prevent delamination and cracks, thereby enhancing capacity and connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of dielectric layer and internal electrode is reduced to increase the number of stacked layers, then the capacity is improved, but the manufacturing precision and reliability deteriorate due to difficulties in developing high-k material composition and limitations in reducing thickness
Solution Approach 1:
The capacitor is divided into multiple unit laminates, each with its own internal electrodes and connecting electrodes. This segmentation allows for manageable thickness control in each layer while achieving high overall capacity through stacking, resolving the contradiction between thin layer requirements and manufacturing precision.
Solution Approach 2:
The patent varies the diameter of connecting electrodes across different unit laminates rather than maintaining uniform dimensions. This parameter change optimizes electrical connectivity and stress distribution, improving reliability while maintaining the ability to achieve high capacity through multiple layers.
2Reliability
If vias or through holes are formed and filled with conductive material to form via electrodes, then the electrical connectivity is improved, but the reliability deteriorates due to delamination and cracks caused by via formation
Solution Approach 1:
Connecting electrodes are formed on the surfaces of unit laminates before stacking, rather than forming vias through the entire stacked structure afterward. This preliminary action prevents the delamination and cracking issues associated with via formation, while still achieving excellent electrical connectivity between layers.
Solution Approach 2:
The problematic via formation process is extracted and replaced with surface electrode formation and stacking. By removing the via formation step entirely and using surface-mounted connecting electrodes instead, the patent eliminates the source of delamination and cracks while maintaining electrical connectivity.
3Quantity of substance
If the thickness of capacitor body is increased to improve capacity, then the quantity of substance is improved, but the reliability deteriorates due to misalignment between connecting electrodes
Solution Approach 1:
The patent intentionally uses connecting electrodes with different diameters in different unit laminates rather than uniform dimensions. This asymmetric design compensates for potential misalignment issues when stacking multiple layers, ensuring reliable electrical connectivity even as the overall capacitor thickness increases for higher capacity.
Data Source
AI summary
A capacitor component includes a multilayer structure including unit laminates. Each unit laminate has a plurality of internal electrodes and a first connecting electrode extending in a stacking direction of the plurality of internal electrodes and connected to portions of the plurality of internal electrodes. First connecting electrodes of unit laminates adjacent to each other among the unit laminates are connected to each other. A diameter of a first connecting electrode of at least one of the unit laminates is different from diameters of first connecting electrodes of other unit laminates.