Capacitor Electrode Via Structure for Lower ESR and High Capacity
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Solution Overview
Problem
There is a demand for capacitors with higher capacity and smaller equivalent serial resistance (ESR) to meet the requirements of downsized and thinner electronic products.
Innovation Solution
A capacitor design featuring internal electrodes stacked with dielectric layers, external electrodes connected through connection vias, and separation layers to reduce equivalent serial resistance (ESR) without capacity loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the capacitor size is reduced to meet downsizing requirements, then the capacity decreases, but the demand requires higher capacity in smaller size
Solution Approach 1:
The patent transitions from conventional planar electrode arrangements to a three-dimensional stacked configuration with internal electrodes extending through multiple dielectric layers. This vertical stacking in the thickness dimension enables higher capacity within a reduced footprint area, effectively resolving the contradiction between size reduction and capacity maintenance.
Solution Approach 2:
The patent implements a nested structure where multiple internal electrodes are stacked within the body, with each electrode surrounded by dielectric layers. This nested arrangement maximizes the electrode surface area within the constrained volume, achieving higher capacity in a compact form factor.
2Reliability
If the equivalent serial resistance (ESR) is reduced, then the electrical connectivity improves, but the structural complexity increases due to additional connection vias and separation layers
Solution Approach 1:
The patent divides the connection path into multiple segments using connection vias that penetrate through dielectric layers. This segmentation allows the external electrodes to connect to internal electrodes through multiple short paths rather than one long path, reducing the overall ESR. The via separation layers further segment the structure to optimize current distribution.
Solution Approach 2:
The patent introduces connection vias as intermediary elements that facilitate electrical connection between external and internal electrodes. These vias act as mediators to reduce contact resistance and improve connectivity. The via separation layers serve as intermediary insulating structures that organize the current paths and reduce interference between adjacent electrodes.
Data Source
AI summary
A capacitor according to an aspect of an embodiment includes: a body that includes a first internal electrode and a second internal electrode stacked with a dielectric layer interposed therebetween; a first external electrode that is disposed to cover an upper surface of the body and an outer side surface of the body and is connected to the first internal electrode through the upper surface of the body and the outer side surface of the body; and a second external electrode that is disposed to cover the upper surface of the body and the outer side surface of the body and is connected to the second internal electrode through the upper surface of the body and the outer side surface of the body.