Capacitor-Wirebond Pad Structures for IC Packages
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Solution Overview
Problem
Conventional integrated circuit (IC) package manufacturing technologies face challenges in accommodating additional hardware for next-generation devices, such as 5G wireless communication devices, which require increased passive components like capacitors, leading to larger device sizes and increased costs.
Innovation Solution
The integration of capacitors and wirebond pads into the IC package support, such as an interposer or substrate, allowing for compact device design without increasing footprint, using capacitor-wirebond pad structures that incorporate capacitor functionality while enabling conventional wirebond formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional passive components like capacitors are added to IC packages for next-generation devices, then device functionality is improved, but device size increases
Solution Approach 1:
The patent combines the capacitor structure with the wirebond pad structure by integrating the capacitor dielectric layer between the first and second capacitor plates within the same vertical space as the wirebond pad, allowing the capacitor to share the footprint area with the wirebond pad rather than requiring separate mounting space
Solution Approach 2:
The capacitor is formed in the vertical dimension by stacking the capacitor dielectric layer between the first capacitor plate (at a first level) and the second capacitor plate (at a second level), utilizing the third dimension (height) to accommodate capacitor functionality without increasing the planar footprint area
2Adaptability or versatility
If additional passive components are separately manufactured and mounted to the package substrate, then device functionality is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The capacitor structure is integrated with the wirebond pad structure by forming both components within the same package support substrate using a unified manufacturing process, eliminating the need for separate capacitor component fabrication and mounting operations
Solution Approach 2:
The package support substrate serves multiple functions simultaneously: it provides mechanical support, forms wirebond pads for electrical connection, and integrates capacitor structures for electrical filtering, combining what were previously separate components into a single multi-functional substrate
Data Source
AI summary
Disclosed herein are capacitor-wirebond pad structures for integrated circuit (IC) packages, as well as related methods and devices. For example, in some embodiments, an IC package may include a die and an IC package support. The IC package support may include a capacitor, and the capacitor may include a first capacitor plate, a second capacitor plate, and a capacitor dielectric between the first capacitor plate and the second capacitor plate. The die may be wirebonded to the first capacitor plate.