Integrated Capacitor Wiring for Accurate Fast Current Detection
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Solution Overview
Problem
Current current detection systems for semiconductor devices face challenges in accurately detecting rapidly changing signals due to inherent limitations of Rogowski coils and increased stray inductance, leading to measurement errors and low accuracy in evaluating dynamic electrical characteristics.
Innovation Solution
A capacitor device with a resistor integrated directly into its wiring, which is connected to the semiconductor device's terminals, reduces stray inductance and allows for direct detection of current, improving detection accuracy and response speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If Rogowski coils are used for current detection, then current detection function is provided, but measurement accuracy deteriorates due to inability to track rapidly changing signals
Solution Approach 1:
The patent combines the capacitor and resistor into a single integrated component structure, where the resistor is formed within the same packaging as the capacitor. This merging eliminates the need for separate detection components and reduces the overall detection loop inductance, enabling accurate tracking of rapidly changing current signals while maintaining current detection functionality.
Solution Approach 2:
The patent changes the electrical parameters of the detection circuit by minimizing stray inductance through integrated construction. By forming the resistor within the capacitor packaging and creating direct electrical connections, the inductance parameter is reduced to a minimum value, allowing the system to respond to rapidly changing signals with high accuracy.
2Measurement precision
If separate resistor and capacitor components are used, then current detection is possible, but stray inductance increases leading to measurement errors
Solution Approach 1:
The patent merges the resistor and capacitor into a single integrated component where the resistor is formed within the capacitor packaging. This integration eliminates the need for separate components and the associated connection inductances, reducing total stray inductance to minimum levels while maintaining functional simplicity.
Solution Approach 2:
The patent implements a nested structure where the resistor is placed inside or within the packaging of the capacitor. The resistor leads are directly connected to the capacitor terminals, creating a compact nested arrangement that minimizes external connection paths and reduces stray inductance without increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the accuracy of current detection and reliability evaluation of semiconductor devices by reducing stray inductance and enabling the tracking of rapidly changing signals, thereby improving the assessment of dynamic electrical characteristics.
Implementation Method 1
reduces stray inductance and allows for direct detection of current, improving detection accuracy and response speed
Data Source
AI summary
A capacitor device connected to a semiconductor device includes a capacitor element including a first electrode and a second electrode, a first wiring and a second wiring. The first wiring has a first one end portion connected to the first electrode and a first other end portion connected to a first electrode terminal of the semiconductor device, and the second wiring has a second one end portion connected to the second electrode and a second other end portion connected to a second electrode terminal of the semiconductor device. A resistor is provided between the first one end portion and the first other end portion of the first wiring and is electrically connected directly to the first wiring.