Capacitorless DRAM Memory Cell Voltage Control for Read Stability

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Solution Overview

Problem

Capacitorless single-transistor DRAM memory cells face issues with large capacitive coupling between the word line and floating body, leading to potential noise and misreading or erroneous rewriting during data read or write operations, making them difficult to implement commercially.

Innovation Solution

A semiconductor memory cell design with a first and second impurity well layer, semiconductor base material, and separate gate conductor layers, where positive hole groups are controlled by applied voltages to perform memory write and erase operations, and a logical-physical conversion table is used to manage the memory device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If capacitorless single-transistor DRAM memory cell is used, then packaging density is improved, but capacitive coupling noise between word line and floating body increases causing misreading or erroneous rewriting

Engineering Contradiction:
Improvepackaging densityVSAvoidcapacitive coupling noise
Core Design Contradiction:
Area of moving objectVSObject-affected harmful factors

Solution Approach 1:

A charge pump circuit is introduced as an intermediary mechanism to actively control and regulate the voltage potential of the floating body. This charge pump compensates for capacitive coupling effects by dynamically adjusting charge levels, thereby preventing noise-induced misreading or erroneous rewriting while maintaining the compact capacitorless structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention dynamically changes the voltage parameter of the floating body through controlled charge pumping. By actively modulating the floating body voltage in response to operational states, the system compensates for capacitive coupling variations and maintains stable logic state differentiation despite the compact design.

Inventive Principle:
Principle #35Parameter changes

2Measurement precision

If floating body voltage is increased to improve logic state differentiation, then measurement precision is improved, but risk of erroneous rewriting due to capacitive coupling increases

Engineering Contradiction:
Improvelogic state differentiationVSAvoiderroneous rewriting
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

A feedback control mechanism is implemented where the charge pump circuit continuously monitors and adjusts the floating body voltage based on the detected logic state. This feedback loop ensures that voltage levels are optimized for differentiation while preventing excessive voltage that could cause erroneous rewriting through capacitive coupling to the word line.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The floating body voltage is made dynamic rather than static, allowing real-time adjustment based on operational conditions. The charge pump actively modulates voltage levels during read and write operations, enabling optimal differentiation during reading while preventing over-voltage conditions that would cause erroneous rewriting.

Inventive Principle:
Principle #15Dynamics

3Device complexity

If compact memory cell structure is used, then device complexity is reduced, but capacitive coupling effects are amplified

Engineering Contradiction:
Improvememory cell structureVSAvoidcapacitive coupling effects
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The charge pump circuit serves as an intermediary control mechanism that decouples the direct capacitive interaction between word line and floating body. By introducing this active control element, the system can maintain compact geometry while the charge pump compensates for coupling effects through dynamic charge regulation.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes the electrical parameters (voltage and charge levels) of the floating body dynamically to compensate for capacitive coupling effects. This parameter modulation allows the compact structure to function reliably by actively adjusting operating conditions to counteract coupling-induced noise.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design minimizes capacitive coupling noise, ensuring stable potential differences between logic states, reducing misreading and erroneous rewriting, and enabling efficient memory operations.

Implementation Method 1

Field Effect-Controlled Charge Regeneration

Methodology Applied
Scientific EffectField effect: Electric Field

Implementation Method 2

positive hole groups generated by an impact ionization phenomenon

Methodology Applied
Scientific EffectImpact ionization: Ionisation

Implementation Method 3

positive hole groups generated by an impact ionization phenomenon or by a gate-induced drain leakage current

Methodology Applied
Scientific EffectGate-induced drain leakage: Electric Field

Data Source

PatentUS12437804B2Semiconductor element memory cell and semiconductor element memory device
Publication Date: 2025.10.07 UNISANTIS ELECTRONICS SINGAPORE PTE LTD
  • US12437804B2 patent drawing
  • US12437804B2 patent drawing
  • US12437804B2 patent drawing

AI summary

By controlling voltages applied to plate lines, word lines, source lines, and bit lines, a memory device that uses semiconductor elements performs a data retention operation of holding positive hole groups formed by an impact ionization phenomenon or by a gate-induced drain leakage current in a semiconductor base material, and a memory erase operation of removing positive hole groups from inside the semiconductor base material. The memory device also performs a data erase operation during the memory erase operation to remove positive hole groups from inside the semiconductor base material of all the memory cells in a block made up of the memory cells, which are arrayed in a matrix.