Wet Microchip Alignment With Grooved Substrates for Large Displays
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Solution Overview
Problem
The pick and place method for transferring micro-LED chips in display apparatuses faces a decrease in transfer yield rate as the size of micro-LEDs decreases and the size of display apparatuses increases, leading to inefficiencies in alignment and placement.
Innovation Solution
A wet alignment method involving a transfer substrate with grooves, where a liquid is supplied and micro-semiconductor chips are aligned using a liquid absorber, allowing for precise placement and alignment of micro-semiconductor chips within the grooves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If pick and place method is used for transferring micro-LED chips, then transfer process can be performed, but transfer yield rate decreases as micro-LED size decreases and display apparatus size increases
Solution Approach 1:
The patent introduces grooves as an intermediary structure on the transfer substrate that physically guides and positions micro-LED chips during transfer. These grooves act as mechanical mediators between the chip placement system and the micro-LED chips, ensuring precise alignment even for smaller chips where traditional pick-and-place precision deteriorates
Solution Approach 2:
The grooves are pre-formed on the transfer substrate before chip placement. This preliminary structuring creates predetermined alignment paths that guide the micro-LED chips into correct positions, eliminating the need for high-precision real-time alignment during the pick-and-place operation itself
2Manufacturing precision
If micro-LED size is reduced to increase display resolution, then display quality improves, but transfer yield rate decreases
Solution Approach 1:
The transfer substrate is designed with localized grooves at specific positions where micro-LED chips should be placed. This local structuring provides enhanced guidance and positioning exactly where needed, allowing smaller chips to be transferred with sufficient precision despite the reduced size
Solution Approach 2:
The grooves serve as mechanical intermediaries that compensate for the reduced size of micro-LED chips. By providing physical guidance structures, the system maintains adequate alignment precision even when the chips themselves become too small for traditional alignment methods to be effective
3Area of stationary object
If display apparatus size is increased to meet market demand, then production capacity improves, but transfer yield rate decreases
Solution Approach 1:
The transfer substrate is divided into multiple regions with individually positioned grooves, allowing the display apparatus to be scaled up in area while maintaining consistent alignment precision across the entire surface. Each groove independently guides chip placement, so the overall system can expand without compromising transfer yield
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the alignment efficiency of micro-semiconductor chips on a transfer substrate, improving the transfer yield rate and enabling the efficient assembly of large display apparatuses with micro-LEDs.
Implementation Method 1
aligning the plurality of micro-semiconductor chips with the plurality of grooves by scanning the transfer substrate by using a liquid absorber
Data Source
AI summary
A wet alignment method for a micro-semiconductor chip and a display transfer structure are provided. The wet alignment method for a micro-semiconductor chip includes: supplying a liquid to a transfer substrate including a plurality of grooves; supplying the micro-semiconductor chip onto the transfer substrate; scanning the transfer substrate by using an absorber capable of absorbing the liquid. According to the wet alignment method, the micro-semiconductor chip may be transferred onto a large area.