Capillary Cooler Layout for Even Cooling in Vertical Electronics Stacks

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Solution Overview

Problem

Conventional cooling systems for electronic devices in vertical stacks require large amounts of electricity to operate pumps and result in pressure loss, leading to inefficient and uneven cooling across the stack.

Innovation Solution

A system utilizing capillary coolers to passively draw a cooling fluid downward through electronic devices, combined with a condenser to condense the fluid, reducing the need for pumps to operate against gravity and minimizing pressure loss.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional cooling systems pump fluid upward through vertical stacks of electronic devices, then the electronic devices can be cooled, but large amounts of electricity are needed to operate the pumps and pressure loss occurs

Engineering Contradiction:
Improvecooling effectivenessVSAvoidelectricity consumption
Core Design Contradiction:
TemperatureVSUse of energy by moving object

Solution Approach 1:

The patent inverts the conventional cooling approach by pumping fluid downward instead of upward through the vertical stacks. The distribution manifold is positioned at the top and fluid is pumped downward through downwardly extending flow paths, allowing gravity to assist the flow rather than oppose it. This inversion eliminates the need for high-power pumps while maintaining effective cooling distribution throughout the stack.

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The patent utilizes gravity as a counterbalancing force to offset the weight of the cooling fluid. By orienting the flow paths downward and positioning the reservoir at the bottom, the system allows gravity to naturally drive the fluid flow through the electronic devices, significantly reducing the mechanical work required by the pump and thereby lowering electricity consumption.

Inventive Principle:
Principle #8Anti-weight (Counterweight)

2Temperature

If conventional cooling systems pump fluid upward through vertical stacks of electronic devices, then the electronic devices can be cooled, but pressure loss occurs across the stacks resulting in uneven cooling

Engineering Contradiction:
Improvecooling effectivenessVSAvoidpressure loss
Core Design Contradiction:
TemperatureVSStress or pressure

Solution Approach 1:

The patent inverts the flow direction to downward flow, which eliminates pressure loss associated with pumping fluid upward against gravity. The distribution manifold at the top distributes fluid to multiple downwardly extending flow paths, ensuring uniform pressure distribution at the inlet while gravity maintains consistent flow pressure throughout the vertical stack, resulting in even cooling across all electronic devices.

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The cooling system is segmented into multiple downwardly extending flow paths within the vertical stack, each providing a separate cooling channel for electronic devices at different levels. This segmentation ensures that each device receives adequate cooling flow with minimal pressure loss, as the fluid is distributed across multiple parallel paths rather than forcing a single high-pressure path through the entire stack.

Inventive Principle:
Principle #1Segmentation

3Ease of operation

If pumps are used to move fluid vertically against gravity, then cooling fluid can be delivered to electronic devices, but electricity consumption increases

Engineering Contradiction:
Improvefluid delivery capabilityVSAvoidelectricity consumption
Core Design Contradiction:
Ease of operationVSUse of energy by moving object

Solution Approach 1:

The system uses gravity as a counterweight to the pump's lifting action. By positioning the fluid reservoir at the bottom and using upwardly extending return paths, the pump only needs to overcome the weight of the fluid in the return path, not the entire vertical lift. This significantly reduces the pump's power requirements while maintaining reliable fluid delivery to all electronic devices in the stack.

Inventive Principle:
Principle #8Anti-weight (Counterweight)

Solution Approach 2:

The patent introduces a distribution manifold as an intermediary component that receives fluid from the pump and distributes it to multiple downwardly extending flow paths. This intermediary structure allows the pump to operate at low pressure while the manifold passively distributes the fluid throughout the stack using gravity and pressure equalization, eliminating the need for high-power pumping while ensuring reliable fluid delivery.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system achieves more efficient electricity use and even cooling across vertical stacks by leveraging capillary action and passive condensation, lowering energy consumption and ensuring consistent temperature regulation.

Implementation Method 1

Capillary coolers include one or more small diameter channels which may passively draw a fluid downward through the vertical stacks of electronic devices

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 2

The fluid may then pass through a condenser to cool the fluid

Methodology Applied
Scientific EffectCondensation: Condensation

Implementation Method 3

The distribution manifold may be placed vertically above the one or more electronic devices and capillary coolers, such that gravity flows the fluid between the distribution manifold and the capillary coolers

Methodology Applied
Scientific EffectGravity: Gravitation

Data Source

PatentUS12477688B2Systems and methods for cooling electronic devices
Publication Date: 2025.11.18 TOYOTA JIDOSHA KK
  • US12477688B2 patent drawing
  • US12477688B2 patent drawing
  • US12477688B2 patent drawing

AI summary

The present disclosure is directed to systems and methods for cooling electronic devices. The system comprises a pump, a distribution manifold fluidly coupled to the pump, one or more capillary coolers fluidly coupled to the distribution manifold, one or more electronic devices coupled to the one or more capillary coolers, a vapor line fluidly coupled to the one or more capillary coolers, and a condenser comprising an inlet and an outlet, wherein the inlet is fluidly coupled to the vapor line and the outlet is fluidly coupled to the pump.