EMI Shielding Package Structure With Capillary Edge Insulation

The patent introduces an insulating layer as an intermediary between the EMI shielding layer and the conductive portions. This insulating layer physically separates the two conductive elements, preventing direct contact and potential short circuits while allowing the EMI shielding layer to remain positioned close to the conductive portions for effective electromagnetic interference shielding.

The patent segments the package structure into distinct functional layers: the EMI shielding layer, the insulating layer, and the conductive portions. By dividing the structure into separate segments with clear functional boundaries, the design achieves both effective EMI shielding and electrical isolation, resolving the contradiction between shielding performance and short circuit prevention.

The insulating layer is applied in advance during the manufacturing process, before final assembly and soldering operations. By performing the insulation application as a preliminary action, the design ensures that the EMI shielding layer is protected from potential short circuits with conductive portions before any soldering materials are introduced, thereby improving reliability without requiring complex post-assembly modifications.

The insulating layer serves multiple functions simultaneously: it provides electrical isolation between the EMI shielding layer and conductive portions, covers the bottom edge of the EMI shielding layer, and integrates with the existing package structure. This multi-functional approach reduces the need for additional separate components or processes, thereby limiting the increase in manufacturing complexity while achieving reliable short circuit prevention.