Capillary Flow Registration for Flexible Circuit Dies
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Solution Overview
Problem
The integration of solid semiconductor dies with flexible, moving substrates in hybrid electronics manufacturing faces challenges in achieving micron-level registration with electrically conductive interconnects, particularly due to substrate distortion and misalignment issues in web-based processes.
Innovation Solution
A method involving a substrate with pockets and channels that utilize capillary pressure to flow and solidify conductive liquids, forming electrically conductive traces directly in contact with contact pads on semiconductor dies, ensuring automatic registration even on stretchy, moving substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If typical wafer-based alignment mechanisms are used, then alignment precision may be sufficient for rigid substrates, but they cannot accommodate substrate distortion and misalignment in web-based flexible processes
Solution Approach 1:
The system uses self-aligning features where the flexible substrate itself provides alignment references through embedded markers or geometric features that automatically guide die placement, eliminating the need for complex external alignment mechanisms and accommodating substrate distortion naturally
Solution Approach 2:
The invention changes the alignment reference from fixed rigid patterns to dynamic references that can accommodate flexible substrate deformation, using parameters such as elastic modulus matching, thermal expansion coefficient matching, or compliant mounting structures that adapt to substrate state changes
2Ease of manufacture
If conventional rigid alignment mechanisms are transferred to web-based processes, then manufacturing experience can be leveraged, but the mechanisms fail to account for substrate movement and stretching
Solution Approach 1:
The invention transitions from static rigid alignment mechanisms to dynamic alignment systems that can adapt to moving and stretching substrates, using compliant mounting structures, real-time feedback sensors, or flexible reference markers that maintain alignment accuracy throughout the web-based manufacturing process
3Manufacturing precision
If micron-level registration is achieved through strict control measures, then alignment precision improves, but process complexity and cost increase significantly
Solution Approach 1:
The invention replaces complex mechanical alignment systems with optical, magnetic, or electrostatic field-based alignment methods that achieve micron-level precision through non-contact means, reducing mechanical complexity while maintaining or improving alignment accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables reliable automatic registration of semiconductor dies with electrically conductive interconnects, tolerating substrate distortions and misalignment, and is applicable in flexible hybrid electronics manufacturing.
Implementation Method 1
flowing the conductive liquid, primarily by a capillary pressure, in the channels toward the first ends to make direct contact with the contact pads of the solid circuit die
Data Source
AI summary
Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.