Capillary Gap Filling via Discharge Stop Time Control

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Solution Overview

Problem

The underfill process in semiconductor packaging requires complex parameter calculations to ensure accurate discharge of viscous materials, leading to errors and limitations in even distribution and correction of discharge amounts due to viscosity changes over time.

Innovation Solution

A method that involves creating an application pattern with temporarily stopping points and non-stopping regions, allowing for adjustment of discharge unit stop times to correct the discharge amount, eliminating the need for complex parameter calculations and enabling stable and error-free liquid material filling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If complex parameter calculations are used to control discharge amount, then manufacturing precision is improved, but device complexity increases

Engineering Contradiction:

Improvedischarge amount precisionVSAvoidparameter calculation complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces complex mechanical control systems (pressurization control, valve reciprocating speed control) with a simplified application pattern control system. The discharge amount is controlled by adjusting the application pattern (temporarily stopping points and non-stopping regions) rather than through complex parameter calculations, thereby reducing device complexity while maintaining manufacturing precision.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the control parameter from complex discharge parameters (pressurization level, valve reciprocating speed) to simple application pattern parameters (stop time at temporarily stopping points). This parameter transformation simplifies the control system while maintaining precise discharge amount control.

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If pressurization level and valve reciprocating speed are controlled, then discharge amount precision is improved, but device complexity increases

Engineering Contradiction:

Improvedischarge amount precisionVSAvoidcontrol system complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical control system involving pressurization level and valve reciprocating speed with a control system based on application pattern adjustment. The discharge amount is controlled by modifying the application pattern (adding temporarily stopping points and non-stopping regions) rather than through complex mechanical parameter control, thereby reducing control system complexity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Manufacturing precision

If complex parameter calculations are performed, then discharge amount accuracy is improved, but productivity decreases

Engineering Contradiction:

Improvedischarge amount accuracyVSAvoidprocess efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent replaces time-consuming complex parameter calculations with a simplified application pattern adjustment method. The discharge amount is controlled by directly adjusting the application pattern (temporarily stopping points and non-stopping regions), eliminating the need for complex calculations and thereby improving productivity while maintaining discharge amount accuracy.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

4Ease of operation

If application pattern is simplified, then ease of operation is improved, but discharge amount precision deteriorates

Engineering Contradiction:

Improvecorrection procedure simplicityVSAvoiddischarge amount precision

Core Design Contradiction:

Ease of operationVSManufacturing precision

Solution Approach 1:

The patent segments the application pattern into temporarily stopping points and non-stopping regions. This segmentation allows for simple adjustment of discharge amount by modifying stop times at specific points, thereby maintaining ease of operation while ensuring precise discharge amount control through targeted adjustments.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies the correction procedures, reduces errors, and allows for stable discharge without the need to control pressurization levels or valve reciprocating speeds, enabling flexible application patterns and efficient filling of gaps between substrates and semiconductor chips.

Implementation Method 1

filling a gap between a substrate and a work placed thereon with a liquid material discharged from a discharge unit by utilizing a capillary action

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Data Source

PatentUS8197738B2Method for filling a gap between a substrate and a work placed thereon

Publication Date: 2012.06.12 MUSASHI ENG INC

AI summary

Provided are a method, an apparatus and a computer program for filling a liquid material, which do not require complicated parameter calculation and which are practiced with easier control. In the method for filling a gap between a substrate and a work placed thereon with the liquid material discharged from a discharge unit by utilizing a capillary action, the method is characterized in forming an application pattern made up of a temporarily stopping point and a non-stopping region along an outer periphery of the work, and correcting a discharge amount of the liquid material by increasing or reducing a time during which the discharge unit is stopped at the temporarily stopping point. The apparatus and the program for carrying out the method are also provided.