Capillary Heat Dissipation Plate Against Gravity
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Solution Overview
Problem
Conventional heat dissipation devices fail to effectively dissipate heat from electronic components located above the surface of the coolant due to gravitational forces hindering coolant circulation.
Innovation Solution
A heat dissipation plate with a capillary structure that allows coolant to flow against gravity by incorporating inclined grooves and a capillary structure within the fluid channel, enabling efficient heat transfer from heat sources both above and below the coolant surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation devices use gravity-dependent coolant circulation, then the device structure is simple, but heat dissipation from components above the coolant surface is ineffective
Solution Approach 1:
The patent applies capillary structures (porous materials) within the circulation channel to enable gravity-independent coolant circulation. The capillary forces in these porous structures drive the coolant to rise and circulate through the channel, allowing effective heat dissipation from electronic components positioned above the coolant surface without requiring complex external pumping systems
Solution Approach 2:
The patent utilizes capillary hydraulic action to create a self-circulating coolant system. The capillary structures generate hydraulic pressure differences that drive coolant flow through the circulation channel, replacing gravity-dependent flow and enabling the coolant to reach and cool components above the liquid surface
2Productivity
If coolant circulation is hindered by gravitational forces, then the device structure remains simple, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent counteracts the harmful effect of gravitational forces by introducing capillary structures that generate upward capillary pressure. This capillary pressure acts as a counterforce to gravity, enabling the coolant to rise against gravitational pull and circulate effectively through the circulation channel, thereby eliminating gravitational hindrance and improving heat dissipation efficiency
3Adaptability or versatility
If the heat dissipation plate cools only components below the coolant surface, then the structure is simple, but the适用范围 (application scope) is limited
Solution Approach 1:
The patent creates a universal heat dissipation system that can cool electronic components regardless of their position relative to the coolant surface. The capillary-based circulation channel serves multiple functions: it enables coolant circulation without gravity dependence, allows cooling of components both above and below the coolant level, and maintains structural integration, thereby achieving multi-functionality and broader application scope
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The capillary structure facilitates coolant circulation and heat dissipation from heat sources regardless of their position relative to the coolant surface, enhancing thermal management efficiency.
Implementation Method 1
A heat dissipation plate with a capillary structure that allows coolant to flow against gravity by incorporating inclined grooves and a capillary structure within the fluid channel
Implementation Method 2
When the heat dissipation plate is in thermal contact with a heat source, such as an electrical component, the coolant in the circulation channel absorbs heat generated by the electronic component
Data Source
AI summary
A heat dissipation device includes a first plate having a first plurality of angled grooves arranged in a first direction, and a second plate having a second plurality of angled grooves arranged in the first direction. The second plate is coupled to the first plate, at least portions of the first plurality of angled grooves and the second plurality of angled grooves are connected to each other such that the first plurality of angled grooves and the second plurality of angled grooves define a fluid channel of the heat dissipation device, and the fluid channel includes coolant. The heat dissipation device also includes at least one capillary structure. At least a portion of the fluid channel is covered by the at least one capillary structure.