Capillary Heater Cooling for Bonding Apparatus
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Solution Overview
Problem
Conventional cooling methods using air flow through narrow parallel plates are ineffective due to low thermal conductivity of air and disturbance in the bonding atmosphere, making it difficult to efficiently cool heaters for bonding apparatuses.
Innovation Solution
The implementation of a heater with capillary slits on one surface and a matching heat insulator surface forming capillary coolant flow-paths, where the coolant air flows through these paths to enhance heat transfer, with controlled airflow rates to maintain a temperature difference for effective cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air is used as cooling medium with conventional flow paths, then the bonding atmosphere is maintained, but cooling efficiency is insufficient due to low thermal conductivity of air
Solution Approach 1:
The patent applies porous ceramic material with capillary pores (0.03-0.5 mm diameter) as the cooling medium structure. The porous structure provides extremely large surface area for heat exchange while maintaining air flow capability. The capillary action in the porous material enhances heat transfer from the heater surface to the cooling air, resolving the contradiction between using air as cooling medium and achieving sufficient cooling efficiency.
Solution Approach 2:
The patent transitions from conventional two-dimensional flow paths between parallel plates to a three-dimensional porous network structure. The capillary pores are distributed throughout the ceramic thickness, creating numerous parallel heat transfer pathways that dramatically increase the effective heat exchange surface area, thereby improving cooling efficiency while maintaining air as the cooling medium.
2Temperature
If large amount of air is blown to cool the heater, then cooling efficiency improves, but bonding atmosphere is disturbed
Solution Approach 1:
The porous ceramic structure with capillary pores enables efficient heat transfer with minimal air flow. The large surface area provided by the porous network allows sufficient cooling even with small amounts of cooling air, thereby preventing disturbance to the bonding atmosphere while maintaining effective heater cooling.
Solution Approach 2:
The patent utilizes capillary pressure and pressure gradient-driven air flow through the porous medium. The cooling air is supplied at controlled pressure to flow through the capillary pores, enabling efficient heat removal with minimal air consumption. This pneumatic approach through porous material achieves cooling effectiveness without requiring large volumes of air that would disturb the bonding atmosphere.
3Device complexity
If air flow path is provided between parallel plates, then cooling structure is simple, but heat transfer area is insufficient
Solution Approach 1:
The porous ceramic material inherently provides a three-dimensional network of capillary pores that dramatically increase the heat transfer surface area within the same physical volume. This porous structure achieves large heat exchange area without adding external cooling components or complex flow path geometries, maintaining structural simplicity while enhancing heat transfer capability.
Solution Approach 2:
The patent transforms the conventional two-dimensional flow path between parallel plates into a three-dimensional porous network. The capillary pores are distributed throughout the entire volume of the ceramic, creating numerous heat transfer pathways in three dimensions. This dimensional transformation dramatically increases the effective heat transfer surface area without proportionally increasing the physical size or structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly increases the effective area for heat exchange, allowing for more efficient cooling of the heater while minimizing airflow disturbances, resulting in improved thermal management for bonding apparatuses.
Implementation Method 1
a large number of capillary slits provided in the second surface. The large number of capillary slits and a matching surface of the heat insulator attached to the second surface form a large number of capillary coolant flow-paths
Implementation Method 2
heat transfer like a disturbed flow that is accompanied by transfer of materials is very small. Accordingly, in order to increase an amount of heat transfer between the surfaces of the parallel plates and the cooling medium, a distance between the parallel plates, that is, a distance of thermal conduction in the cooling medium is important
Implementation Method 3
causing coolant air to flow over a surface of the ceramic heater
Data Source
AI summary
Provided is a plate-like heater for a bonding apparatus (30) including: a lower surface (31b) to which a bonding tool (40) is attached; and an upper surface (31a) to which a heat insulator (20) is attached. The upper surface (31a) is provided with a large number of capillary slits (35), and the large number of capillary slits (35) and a matching surface (21) of the heat insulator (20) attached to the upper surface (31a) form a large number of capillary coolant flow-paths (37) each extending from a cavity (36) to a lateral surface (33). This allows effective cooling of the heater for a bonding apparatus.