Capillary Interface Joining Structure for Continuous Fluid Conduction
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Solution Overview
Problem
Existing capillary devices face challenges in effectively bonding capillary structures due to issues such as pores, discontinuous surfaces, and deformation at the interface, leading to poor conductivity of working fluids.
Innovation Solution
A connecting structure is introduced at the interface between capillary structures, using a connecting material different from the metal materials of the capillary structures, which is bonded through a thermal process to form a connecting structure that maintains capillary function while preventing deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If direct bonding is used to connect capillary structures, then the bonding process is simple, but the interface quality is poor with pores, discontinuous surfaces, and deformation
Solution Approach 1:
A connecting structure is introduced as an intermediary component between the first and second capillary structures. This connecting structure includes a connecting material that is different from the metal materials of the capillary structures themselves, serving as a mediator to achieve reliable bonding while maintaining interface quality and preventing deformation.
2Strength
If strong external force is applied to make capillary structures contact tightly, then the connection strength increases, but the rigid structure deforms
Solution Approach 1:
The connecting structure changes the material parameter at the interface by using a connecting material that is different from the rigid metal materials of the capillary structures. This parameter change allows the interface to accommodate bonding forces without causing deformation to the rigid capillary structures, while still achieving strong connection.
3Device complexity
If capillary structures are directly bonded, then the device complexity is reduced, but the working fluid conduction is compromised due to interface defects
Solution Approach 1:
The connecting structure serves as an intermediary that ensures reliable fluid conduction across the interface between capillary structures. By using a specialized connecting material, it prevents pores and discontinuous surfaces that would otherwise compromise fluid flow, while adding minimal complexity to the overall device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The connecting structure ensures effective fluid conduction and improved bonding between capillary structures, enhancing the overall performance of the capillary device by preventing discontinuities and deformation.
Implementation Method 1
performing a thermal process on the connecting element to form a connecting structure connecting the first capillary structure and the second capillary structure
Data Source
AI summary
A capillary device and a formation method thereof are provided. The capillary device includes a first element, a second element, and a connecting structure. The first element includes a first supporting layer and a first capillary structure disposed on the first supporting layer and including a first metal material. The second element includes a second supporting layer and a second capillary structure disposed on the second supporting layer and including a second metal material. The connecting structure is disposed on the interface between the first capillary structure and the second capillary structure. The connecting structure connects the first capillary structure and the second capillary structure. The connecting structure includes a connecting material that is different from the first metal material and the second metal material.