Capillary Liquid Conductor Wiring for Semiconductor Interconnects
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Solution Overview
Problem
Existing methods for forming metal wiring lines in semiconductor devices often result in unstable electrical connections due to small contacting areas between the wiring lines and external connection electrodes, requiring cumbersome processes to bury steps between substrates and electrodes.
Innovation Solution
A method involving the transfer of an electronic component with a cavity between its electrode and substrate, where a conductive liquid material is applied using an inkjet method, flowing into the cavity by capillary action to form a wiring line with a larger contact area, thereby improving stability without needing to bury steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a wiring line is formed to contact the side surface of the external connection electrode, then the manufacturing process is simplified, but the electrical connection stability is poor due to small contacting area
Solution Approach 1:
The patent transitions from side-surface contact (one-dimensional line contact) to upper-surface contact (two-dimensional area contact) by forming the wiring line on the same plane as the external connection electrode, fundamentally changing the contact geometry to increase contact area and improve electrical connection stability
2Reliability
If the wiring line contacts the upper surface of the external connection electrode, then the electrical connection stability is improved with larger contact area, but the step between substrate and electrode must be buried requiring additional processes
Solution Approach 1:
The patent performs preliminary action by forming the external connection electrode to protrude from the substrate surface before forming the wiring line, creating a pre-formed cavity that naturally receives the wiring line material and eliminates the need for subsequent step-burying processes
3Reliability
If the external connection electrode protrudes from the substrate surface, then the contact area with wiring line is increased, but a step is formed requiring additional processing
Solution Approach 1:
The patent employs self-service by designing the cavity structure to automatically guide and contain the wiring line material through capillary action, where the cavity walls themselves serve as the containment structure, eliminating the need for external masking or enclosure processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the stability and reliability of electrical connections by increasing the contact area between the wiring line and the electrode, reducing failures and simplifying the manufacturing process.
Implementation Method 1
the wiring line is formed in the cavity... a liquid material containing a conductive material is preferably coated on the second substrate, and the liquid material flows into the cavity by a capillary phenomenon
Data Source
AI summary
A method for manufacturing a semiconductor device includes: (a) transferring an electronic component that has an electrode and formed on a first substrate from the first substrate to a second substrate; and (b) forming a wiring line electrically coupling the electrode and a terminal on the second substrate. A cavity is provided between the electrode of the electronic component transferred on the second substrate and the second substrate, and the wiring line is formed in the cavity.