Capillary Pumped Loop Cooling for Phased Array Antennas

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Solution Overview

Problem

Existing cooling techniques for phased array antenna systems, such as mechanically pumped coolants and heat pipes, face reliability concerns and inefficiencies in managing temperature gradients across two-dimensional arrays, particularly in space vehicles where mechanical failures are difficult to repair and heat distribution is inadequate.

Innovation Solution

A capillary pumped loop cooling system utilizing evaporators with wicks and a manifold to distribute cooling fluid based on heat requirements, leveraging capillary pressure to minimize temperature gradients without the need for overlapping heat pipes or additional electronic circuitry.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If mechanically pumped coolants are used, then cooling capability is provided, but reliability deteriorates due to mechanical failure risk

Engineering Contradiction:
Improvecooling system reliabilityVSAvoidmechanical pump complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical pump system with a capillary pumped loop system that uses capillary forces in wicks to drive coolant circulation. This eliminates moving parts and mechanical failure points while maintaining effective cooling capability across the phased array antenna system.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The capillary pumped loop system is self-regulating, using the coolant's own capillary action through the wick material to circulate and distribute cooling fluid. The system automatically adapts to varying heat loads without external control mechanisms, improving reliability while reducing mechanical complexity.

Inventive Principle:
Principle #25Self-service

2Temperature

If heat pipes are used, then one-dimensional heat transport is achieved, but two-dimensional temperature gradient control deteriorates

Engineering Contradiction:
Improvetemperature uniformityVSAvoidheat pipe layer complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent transitions from one-dimensional heat pipe transport to two-dimensional capillary-driven coolant distribution. The manifold structure with multiple passageways enables coolant to flow in multiple directions simultaneously, achieving uniform temperature control across the entire two-dimensional array without requiring overlapping heat pipe layers.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The cooling system is segmented into multiple independent evaporators, each with its own wick and coolant supply through the manifold. This segmentation allows localized heat dissipation control at each antenna element while maintaining overall temperature uniformity, avoiding the need for complex overlapping heat pipe configurations.

Inventive Principle:
Principle #1Segmentation

3Temperature

If overlapping layers of heat pipes are added, then transverse heat distribution is improved, but weight and size increase

Engineering Contradiction:
Improveheat distribution uniformityVSAvoidcooling system weight
Core Design Contradiction:
TemperatureVSWeight of stationary object

Solution Approach 1:

The capillary pumped loop system performs multiple functions with a single structure: the wick material simultaneously provides coolant transport, heat conduction, and pressure regulation. The manifold serves both as a distribution network and as part of the thermal management structure, eliminating the need for separate overlapping heat pipe layers and reducing overall system weight.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Temperature

If capillary pumped loop with manifold is used, then fluid distribution is optimized, but device complexity increases

Engineering Contradiction:
Improvecooling efficiencyVSAvoidmanifold structure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The wick material in the capillary pumped loop uses porous structure to provide capillary forces for coolant circulation. This passive mechanism optimizes fluid distribution to match heat generation patterns without requiring complex active control systems or sophisticated manifold designs, achieving efficient cooling with simpler overall architecture.

Inventive Principle:
Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The capillary pumped loop cooling system effectively controls temperature gradients and maintains optimal cooling across phased array antenna systems, reducing weight and complexity while accommodating variable heat generation, thus enhancing reliability and efficiency.

Implementation Method 1

Capillary pressure of a cooling fluid within a wick in a loop is utilized to urge the fluid to travel around the loop

Methodology Applied
Scientific EffectCapillary pressure: Capillary Pressure

Implementation Method 2

A capillary pumped loop cooling system utilizing evaporators with wicks and a manifold to distribute cooling fluid based on heat requirements

Methodology Applied
Scientific EffectPhase change: Phase Change

Data Source

PatentUS7841392B1Method and apparatus for controlling temperature gradients within a structure being cooled
Publication Date: 2010.11.30 RAYTHEON CO
  • US7841392B1 patent drawing
  • US7841392B1 patent drawing
  • US7841392B1 patent drawing

AI summary

A phased array antenna apparatus has a plurality of circuit portions which are each coupled to a respective antenna element. Capillary pressure of a cooling fluid within a wick in a loop is utilized to urge the fluid to travel around the loop, the wick being disposed in the region of the circuitry. In a variation, there are plural wicks in respective evaporators, and cooling fluid is distributed among the evaporators through a series of T-junctions. In another variation, cooling fluid is distributed to a plurality of evaporators in a sequence corresponding to a progressive increase in the respective amounts of heat accepted by the evaporators from structure being cooled.