Capillary Structure Paste for Vapor Chamber Heat Transfer
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Solution Overview
Problem
The miniaturization of electronic equipment has led to higher requirements for the size and performance of vapor chambers, with existing liquid absorbing wicks such as copper foam and copper mesh resulting in large, thick vapor chambers with poor liquid absorption and heat transfer performance.
Innovation Solution
A capillary structure is prepared using a paste comprising metal powder, compound powder, adhesive, and organic solvent, which forms grooves and through holes upon sintering, improving liquid absorption and heat transfer performance while allowing for a thin and lightweight vapor chamber design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper foam or copper mesh is used as liquid absorbing wick, then the vapor chamber can be manufactured, but the vapor chamber size becomes large and thick
Solution Approach 1:
The patent uses a capillary structure with controlled pores formed by compound powder particles. These pores provide liquid absorption capability while maintaining a compact structure. The porous configuration allows efficient capillary action without requiring the large volume of traditional copper foam or mesh, thus resolving the contradiction between liquid absorption performance and vapor chamber size.
Solution Approach 2:
The patent creates a composite structure by combining metal powder (copper) with compound powder (such as aluminum powder or other pore-forming agents) in a paste formulation. This composite approach allows the metal powder to provide thermal conductivity while the compound powder forms the necessary capillary pores, achieving both heat dissipation and liquid absorption in a compact configuration.
2Reliability
If copper foam or copper mesh is used as liquid absorbing wick, then the vapor chamber can be manufactured, but the vapor chamber thickness becomes thick
Solution Approach 1:
The capillary structure employs a porous configuration where compound powder particles create interconnected pores within a thin layer. This porous architecture provides sufficient surface area and capillary pathways for liquid absorption without requiring increased thickness, allowing the vapor chamber to maintain thinness while preserving liquid absorption performance.
Solution Approach 2:
The patent transitions from traditional planar copper foam or mesh structures to a three-dimensional capillary structure formed by randomly distributed compound powder particles. This dimensional transformation creates vertical pore networks that enhance liquid absorption capability within a thin profile, effectively solving the thickness problem while maintaining absorption performance.
3Reliability
If copper foam or copper mesh is used as liquid absorbing wick, then the vapor chamber can be manufactured, but heat transfer performance becomes poor
Solution Approach 1:
The paste formulation combines metal powder (providing thermal conductivity) with compound powder (providing pore structure). The metal powder particles create conductive pathways for heat transfer while the compound powder forms the capillary network for liquid absorption, achieving both heat transfer and liquid absorption functions simultaneously in a synergistic composite structure.
Solution Approach 2:
The porous capillary structure formed by compound powder particles provides both thermal conductivity pathways and liquid absorption capability. The interconnected pores allow heat to be conducted through the structure while simultaneously enabling liquid wicking, thus resolving the contradiction between heat transfer performance and liquid absorption performance.
4Shape
If additional pore-forming agents are used, then the capillary structure can be formed, but delamination occurs
Solution Approach 1:
The patent optimizes the particle size parameters of the compound powder (0.1-100 μm) and metal powder (0.1-100 μm) to ensure proper adhesion and structural integrity. By controlling the size distribution and composition ratios, the paste forms a cohesive capillary structure without delamination, resolving the contradiction between capillary structure formation and structural stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The capillary structure enhances liquid absorption and heat transfer performance, meeting the size requirements for miniaturized vapor chambers with improved controllability and quality, and eliminates the need for additional pore-forming agents that can cause delamination.
Implementation Method 1
The organic solvent is configured for dissolving the adhesive
Implementation Method 2
The adhesive is configured for bonding the metal powder and the compound powder to a vapor chamber
Implementation Method 3
The metal powder forms a matrix of the capillary structure in the vapor chamber after drying
Implementation Method 4
The compound powder forms grooves and through holes on the matrix
Implementation Method 5
The capillary structure enhances liquid absorption and heat transfer performance
Data Source
AI summary
The present disclosure provides paste for preparing a capillary structure, a preparation method of the paste, a preparation method of the capillary structure, and a vapor chamber. The paste includes metal powder with a mass fraction of 20-80%, compound powder with a mass fraction of 10-70%, adhesive with a mass fraction of 0.1-20%, and organic solvent with a mass fraction of 5-40%. The organic solvent dissolves the adhesive. The adhesive adheres the metal powder and the compound powder to a vapor chamber. The metal powder forms a matrix of the capillary structure in the vapor chamber after drying. The compound powder forms grooves and through holes on the matrix. The capillary structure has a controllable size to meet size requirements of the vapor chamber. The capillary structure includes the through holes and the grooves, which improves liquid absorption performance and improves heat transfer performance.