Capillary-Filled Reconstituted Circuit Assembly for Stacked IC Dies
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Solution Overview
Problem
Existing integrated circuit packaging technologies face challenges in achieving faster, smaller, and thinner designs while addressing latency, bandwidth density, and thermal control, with monolithic integration and wafer stacking having limitations.
Innovation Solution
A reconstituted circuit device is formed using capillary action to flow a material between integrated circuit dies, creating a rigid mass that supports and connects multiple IC dies, utilizing organic polymers and inorganic compounds for efficient structural support and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If monolithic integration is used to increase computing core counts and memory capacity, then device functionality is improved, but parasitic capacitance increases and performance decreases
Solution Approach 1:
The patent divides the monolithic integrated circuit into multiple separate dies that are stacked vertically. Each die can be independently optimized and manufactured, reducing the parasitic capacitance that would exist in a large-area monolithic device while maintaining the overall functionality through inter-die connections.
Solution Approach 2:
The patent transitions from two-dimensional monolithic integration to three-dimensional stacked architecture. By stacking dies vertically, the patent achieves higher computing core counts and memory capacity without increasing the planar area, thereby reducing parasitic capacitance while maintaining enhanced functionality.
2Adaptability or versatility
If wafer stacking is used to assist heterogeneity between memory and computing devices, then device heterogeneity is improved, but design complexity and area penalty remain
Solution Approach 1:
The patent employs a reconstituted wafer platform that can accommodate multiple types of dies (computing, memory, I/O) in a standardized stacked architecture. This universal platform reduces design complexity by providing a common interconnection and packaging framework that works across different die types and functionalities.
Solution Approach 2:
The patent introduces a reconstituted wafer as an intermediary structure between individual dies. This wafer provides standardized mechanical support, electrical interconnections, and thermal management, simplifying the integration of heterogeneous dies while reducing the overall design complexity compared to direct die-to-die stacking.
3Speed
If reconstituted wafer is used to address monolithic integration issues, then latency and bandwidth density are improved, but thermal control challenges remain
Solution Approach 1:
The patent implements localized thermal management solutions at each die level within the stacked architecture. By providing dedicated thermal pathways and heat dissipation structures for each die, the system can effectively manage heat generation from high-speed computing and memory operations, maintaining low latency and high bandwidth density while controlling temperatures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables faster and more reliable assembly of integrated circuit dies, improving latency, bandwidth density, and thermal control, facilitating the creation of smaller and more efficient electronic devices.
Implementation Method 1
a flow of material by capillary action between two integrated circuit (IC) dies
Data Source
AI summary
Techniques and mechanisms for a reconstituted circuit device to be formed using a flow of material, by capillary action, in a region between a first die and a second die. In an embodiment, a rigid mass extends around, and between, the first die and the second die. The rigid mass comprises a first body of a first material, and a second body of second material, wherein the bodies each extend across the region to respective sidewall structures of the first and second dies. In the region, a portion of the first body forms a surface structure which adjoins the second body. A concave or convex shape of the surface structure is an artefact of a meniscus formed by the first material during a liquid state thereof. In another embodiment, the reconstituted circuit device further comprises an interconnect which adjoins, and extends through, the rigid mass.