Capped Plated Through-Hole for High-Density Circuit Substrates
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Solution Overview
Problem
Existing methods for creating circuitized substrates, such as printed circuit boards and chip carriers, face challenges in achieving high-density circuit patterns necessary for efficient high-frequency signal transmission, particularly due to impediments in signal passage through multi-layered interconnect structures.
Innovation Solution
A method involving the formation of 'capped' or interlocking vertically oriented conductive through-holes, where a second plated through-hole is partially positioned within the first, ensuring effective electrical coupling and anchoring, and allowing for high-density pattern formation using conventional manufacturing equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional plated through-holes are used in multi-layered substrates, then manufacturing is simpler, but signal transmission impedance and loss increase at high frequencies
Solution Approach 1:
The through-hole structure is segmented into multiple functional zones: a land portion at the surface level for electrical connection, a barrel portion extending through the dielectric layer, and a capped portion filled with conductive material. This segmentation allows each zone to optimize for its specific function, reducing signal impedance while maintaining manufacturability
Solution Approach 2:
The capped plated through-hole structure nests the conductive cap within the through-hole barrel, creating an interlocking vertical arrangement. The cap is positioned within the hole and extends partially or fully to the surface, forming a nested configuration that enhances electrical coupling and reduces impedance without requiring completely separate structures
2Volume of moving object
If substrate thickness is reduced for miniaturization, then product size decreases, but electrical coupling between layers deteriorates
Solution Approach 1:
The through-hole structure combines multiple materials: the dielectric layer material, the conductive plating material forming the barrel and land portions, and the conductive cap material. This composite structure provides enhanced electrical coupling through the cap-barrel interface while maintaining reduced substrate thickness for miniaturization
3Productivity
If circuit density is increased to meet I/O requirements, then signal transmission capability improves, but manufacturing precision requirements increase
Solution Approach 1:
The plating process is performed preliminarily on the through-holes before final assembly, creating the conductive land and barrel portions in advance. This preliminary plating action establishes precise electrical pathways that can accommodate high circuit density while maintaining manufacturing feasibility through standardized processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances signal transmission by providing reliable, high-density interconnections and reduces substrate thickness, meeting stringent operational requirements for miniaturized electronic products.
Implementation Method 1
a first plated through hole within the first layer of dielectric material... a second plated through hole within this second layer of dielectric material, the second plated through hole extending a predetermined depth within the first plated through hole
Data Source
AI summary
A method of making a circuitized substrate in which pairs of vertically oriented though holes are formed such that at least one of the through holes is partially embedded within a lower one, thus assuring a sound connection following subsequent lamination or other steps the substrate including such holes is subjected to during manufacture. An electrical assembly including a substrate with such features is also provided.