Capsule Medical Apparatus Molded Body Interval Control
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Solution Overview
Problem
Existing capsule medical apparatus manufacturing methods face challenges in efficiently maintaining inter-board intervals between rigid circuit boards while ensuring water-tightness and reducing manufacturing time.
Innovation Solution
The use of molded bodies formed from flexible circuit boards to cover functional components on rigid circuit boards, maintaining inter-board intervals through direct contact between molded bodies and rigid boards, and employing a hot melt resin for easy assembly and reduced stress on components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If rigid circuit boards are connected via flexible circuit boards with functional components mounted on them, then the capsule medical apparatus can be assembled with necessary electronic components, but the inter-board interval maintenance becomes difficult and manufacturing time increases
Solution Approach 1:
Molded bodies covering functional components are formed in advance on the rigid circuit boards before assembly. This preliminary formation of protective molded bodies eliminates the need for time-consuming post-assembly operations and simplifies the overall manufacturing process by preparing components ready for direct installation.
Solution Approach 2:
The patent combines multiple functions into the molded bodies: they provide mechanical protection for functional components, maintain inter-board intervals through direct contact between oppositely arranged molded bodies, and enable water-tight sealing. This merging of protection, spacing, and sealing functions into a single component reduces assembly steps and manufacturing time.
2Productivity
If molded bodies are formed to cover functional components and maintain inter-board intervals, then assembly is simplified and manufacturing time is reduced, but water-tightness may be compromised
Solution Approach 1:
Water-tight sealing members are introduced as intermediary elements between the molded bodies and the rigid circuit boards or capsule casing. These sealing members fill the gaps and interfaces created by the molded body structure, ensuring water-tightness is maintained while preserving the assembly efficiency benefits of the molded body approach.
Solution Approach 2:
The solution employs composite construction where molded bodies ( providing structural protection and spacing) are combined with sealing members (providing water-tight barrier). This composite approach allows each material to perform its optimal function - the molded bodies maintain intervals and protect components while the sealing members ensure water-tightness, achieving both productivity and reliability goals.
3Device complexity
If traditional assembly methods are used without pre-formed molded bodies, then manufacturing complexity is maintained, but stress on functional components increases during assembly
Solution Approach 1:
Molded bodies are formed in advance on the rigid circuit boards before assembly operations. This preliminary formation creates protective enclosures for functional components, ensuring they are shielded from mechanical stress during subsequent assembly steps. The pre-formed molded bodies act as protective fixtures that reduce handling stress on delicate electronic components.
Solution Approach 2:
The molded bodies serve as protective cushioning structures formed beforehand to enclose and protect functional components. This beforehand protection prevents direct exposure of sensitive components to assembly stresses, mechanical impacts, and environmental factors, thereby reducing component stress and improving reliability without adding significant manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient inter-board interval maintenance, reduced manufacturing time, and improved assembly of capsule medical apparatuses with enhanced water-tightness and stress reduction on components.
Implementation Method 1
employing a hot melt resin for easy assembly and reduced stress on components
Implementation Method 2
The use of molded bodies formed from flexible circuit boards to cover functional components on rigid circuit boards
Data Source
AI summary
A capsule medical apparatus is provided with a plurality of rigid boards which are connected in line via a flexible board; and molded bodies. The molded bodies are formed in a manner of covering functional components mounted on the respective rigid boards. The molded bodies keep an inter-board interval between the rigid boards by intervening between facing rigid boards. The molded bodies keep an inter-board interval between the rigid boards by intervening between facing rigid boards.


