Capsule Heat Conduction Column Using Phase Change Materials
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Solution Overview
Problem
Traditional heat dissipation devices are inadequate for efficiently managing the increasing heat generated by high-density, high-performance electronic components, leading to overheating and reduced stability and service life.
Innovation Solution
A capsule type heat conduction column is manufactured by mixing thermally conductive materials like graphene, carbon nanotubes, and phase change materials, and compacting them into a sealed capsule with thermal interface materials to enhance 3D heat dissipation and electromagnetic wave absorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional heat dissipating devices are used, then manufacturing cost is low and structure is simple, but heat dissipation efficiency is insufficient for high-density electronic components
Solution Approach 1:
The patent uses composite phase change materials combining paraffin wax with graphite or carbon nanotubes to achieve both high heat absorption capacity and high thermal conductivity, resolving the contradiction between heat dissipation efficiency and material complexity
Solution Approach 2:
The patent utilizes phase change materials that absorb heat during melting phase transition, providing passive heat dissipation without requiring complex active cooling systems, thus improving heat dissipation efficiency while maintaining relatively simple device structure
2Power
If high-density electronic components are used, then component efficacy is improved, but heat generation quantity increases leading to overheating
Solution Approach 1:
Phase change materials absorb excess heat from high-power electronic components through melting phase transition, maintaining operational temperature within safe ranges while preserving the high efficacy benefits of high-density components
Solution Approach 2:
The phase change material acts as an intermediary thermal management layer between high-power electronic components and the environment, absorbing and transferring heat to prevent overheating while allowing components to operate at high power levels
3Temperature
If thermally conductive materials are used to improve heat dissipation, then heat conduction performance is improved, but manufacturing cost increases
Solution Approach 1:
The patent combines inexpensive paraffin wax with small amounts of thermally conductive additives like graphite or carbon nanotubes, achieving high heat conduction performance at lower cost compared to using pure metal thermal interface materials
Solution Approach 2:
The phase change material is contained in a porous structure or capsule that allows for cost-effective manufacturing while maintaining thermal contact with heat-generating components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases heat dissipation efficiency, extends service life, reduces manufacturing costs, and promotes environmental sustainability through recyclability.
Implementation Method 1
capsule type heat conduction column... thermally conductive base material... increases efficiency of 3-dimentional heat dissipation
Implementation Method 2
the second material is selected from the group consisting a phase change material... increases efficiency of 3-dimentional heat dissipation
Implementation Method 3
increases efficiency of 3-dimentional heat dissipation and electromagnetic wave absorption... first material is selected from the group consisting of a grapheme, a carbon nanotube, a reduced expanded graphite, a carbon fiber and a carbon
Data Source
AI summary
The present invention relates to a capsule type heat conduction column and a method for manufacturing the same. The method comprises the steps of mixing a thermally conductive base material thoroughly, stuffing and compacting the thermally conductive base material into a capsule formed by a first pipe and a second pipe, and sealing the capsule by a plurality of thermal interface materials. Each of the first pipe and the second pipe has a first opening and a second opening at two terminals thereof, and the second opening of the first pipe is assembled to the first opening of the second pipe.