Conductive Carbon Black Composites with Non-Conductive Polymer

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Solution Overview

Problem

Conventional electrostatic dissipative materials have a steep percolation curve, leading to a narrow range of filler concentration for achieving desired surface resistivity, making them sensitive to variations in filler loading, which can result in undesirable changes in electrostatic dissipative properties.

Innovation Solution

The development of electrostatic dissipative composites comprising a thermoplastic polymer matrix with a filler system consisting of conductive carbon black and ultra-high molecular weight polyethylene, which forms a continuous conductive network at a critical loading, providing a flat percolation curve and maintaining surface resistivity within the range of 10^6 to 10^9 ohms per square.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional conductive carbon black filled thermoplastic resin is used, then electrostatic dissipative properties are achieved, but the percolation curve is steep resulting in narrow filler concentration range and high sensitivity to variations

Engineering Contradiction:
Improveelectrostatic dissipative propertiesVSAvoidfiller concentration control
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies composite materials by combining conductive carbon black with non-conductive polymer particles (such as polyethylene, polypropylene, or styrene-butadiene rubber) within the thermoplastic resin matrix. This composite filler system creates a more gradual percolation curve, allowing the material to maintain electrostatic dissipative properties (surface resistivity between 10^6 to 10^9 ohms/sq) over a broader range of filler concentrations, thereby reducing sensitivity to manufacturing variations in filler loading.

Inventive Principle:
Principle #40Composite materials

2Reliability

If filler concentration is increased to ensure electrostatic dissipative properties, then reliability improves, but material properties and processing characteristics deteriorate

Engineering Contradiction:
Improveelectrostatic dissipative propertiesVSAvoidprocessing characteristics
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent utilizes parameter changes by introducing non-conductive polymer particles with specific size ranges (0.1 to 10 micrometers) and controlling their concentration (1 to 20 parts by weight per 100 parts of thermoplastic resin). These parameter adjustments allow the formation of a percolation network at lower overall filler concentrations, maintaining electrostatic dissipative properties while preserving better processing characteristics and material properties compared to high filler loading conventional systems.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution results in robust electrostatic dissipative composites that are less affected by minor changes in filler composition or distribution, offering improved mechanical, thermal, and morphological properties while maintaining consistent surface resistivity across a wider range of conditions.

Implementation Method 1

conductive carbon black and a non-conductive polymer... forms a continuous conductive network at a critical loading, providing a flat percolation curve and maintaining surface resistivity within the range of 10^6 to 10^9 ohms per square

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentEP3575354B1Broadening of percolation slope in conductive carbon black compositions with at least one non-conductive polymer
Publication Date: 2023.06.07 SHPP GLOBAL TECH BV
  • EP3575354B1 patent drawingFigure 1
  • EP3575354B1 patent drawingFigure 2
  • EP3575354B1 patent drawingFigure 3

AI summary

The present disclosure relates to thermoplastic electrostatic dissipative (ESD) composites. The disclosed compositions comprise a thermoplastic resin phase and a filler composition comprising a conductive carbon black and a non-conductive polymer, dispersed within the thermoplastic resin phase. Also disclosed are methods for the manufacture of the disclosed composites and articles of manufacture comprising same.