Carbon Fiber Negative Electrode Tab Connection Without Metal Plating

The patent extracts the metal plating process from the carbon fiber connection method, replacing it with direct mechanical pressing of the tab onto the carbon fiber layers. This eliminates the time-consuming plating step while maintaining electrical connection through the conductive nature of carbon fiber itself, thereby improving productivity without sacrificing current extraction effectiveness

The patent introduces a conductive adhesive as an intermediary substance between the tab and carbon fiber layers. This adhesive mediator enables effective electrical connection and mechanical bonding without requiring metal plating, thus resolving the contradiction between connection reliability and production efficiency by providing a direct bonding solution that eliminates intermediate plating steps

The patent removes the metal plating process entirely from the manufacturing sequence, using direct mechanical pressing combined with conductive adhesive to achieve both mechanical strength and electrical conductivity. This extraction of the plating step directly reduces material costs (no metal coating materials needed) and process costs (no plating equipment or operations required), while maintaining adequate current extraction through the conductive adhesive pathway

The patent employs a conductive adhesive layer as a consumable, low-cost intermediary that provides both bonding and electrical connection functions. This inexpensive adhesive material replaces expensive metal plating materials and the associated high-cost plating processes, achieving cost-effective manufacturing while maintaining functional performance through the adhesive's dual role as binder and conductor

The patent merges multiple functions into the conductive adhesive: mechanical bonding between tab and carbon fiber, electrical conduction pathway creation, and surface filling for uniform contact. By combining these functions in a single material layer, the adhesive achieves adequate conductive performance without requiring metal plating, thus maintaining productivity benefits while improving electrical connection reliability through multi-functional integration

The patent uses a composite approach by combining the conductive adhesive with the carbon fiber layers and tab structure to create an integrated conductive system. The adhesive forms a composite bonding layer that leverages the conductive properties of both the adhesive material and the carbon fiber, creating a hybrid conduction pathway that achieves reliable electrical performance without metal plating, thereby resolving the contradiction between using simple adhesive and maintaining conductive performance