Thermal Interface Using Carbon Fiber Configuration
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Solution Overview
Problem
Existing thermal interfaces for electronics, particularly ball grid array packages, face challenges in efficiently directing heat away while minimizing stress on the packaging due to hardening additives that increase thermal conductivity but can cause undue stress.
Innovation Solution
A thermal interface utilizing carbon fibers of varying lengths extending between electronics packaging and a target object, with pads secured to both surfaces, and optionally incorporating heat spreader materials with larger footprints to enhance thermal conductivity and reduce thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal conductivity additives are used in the thermal interface, then thermal conductivity is improved, but the interface hardens and places undue stress on the package
Solution Approach 1:
The patent changes the physical state and composition of the thermal interface material from a hardened additive-based compound to a flexible carbon fiber structure. The carbon fibers maintain high thermal conductivity while the flexible matrix prevents hardening, directly resolving the contradiction between thermal performance and mechanical stress.
Solution Approach 2:
The thermal interface uses a composite structure combining carbon fibers (for thermal conductivity) with a flexible matrix material. This composite approach allows the interface to simultaneously achieve high thermal conductivity through the carbon fibers while maintaining flexibility and reducing stress through the compliant matrix.
2Loss of energy
If thermal conductivity additives are used in the thermal interface, then heat transfer is improved, but stress on the package increases
Solution Approach 1:
The patent transforms the thermal interface from a rigid additive-based material to a flexible carbon fiber structure. This parameter change maintains efficient heat transfer through the carbon fibers' high thermal conductivity while the flexible nature of the interface reduces mechanical stress on the package.
Solution Approach 2:
The thermal interface employs a flexible structure where carbon fibers are embedded in a compliant matrix. This flexible construction allows the interface to conform to package contours and reduces stress transmission while maintaining effective thermal coupling through the carbon fiber network.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The carbon fiber configuration provides a softer, more flexible interface that reduces thermal resistance and stress on the packaging, effectively directing heat away while maintaining high thermal conductivity, thereby minimizing Theta-JC and maximizing heat removal.
Implementation Method 1
Carbon fibers having varying lengths extend from the second side towards the other of the electronics packaging and the target object
Data Source
AI summary
A thermal interface for positioning between an electronics packaging and a target object includes a pad having a first side facing one of the electronics packaging and the target object and a second side. Carbon fibers having varying lengths extend from the second side towards the other of the electronics packaging and the target object.