Carbon-Fiber Wafer Holding Ring for Low-Warpage Polishing
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Solution Overview
Problem
Existing holding tools for semiconductor wafers suffer from mechanical strength limitations, leading to scratches and wear during polishing, and are prone to electrostatic charging, which affects the quality and yield of semiconductor chips.
Innovation Solution
A holding tool configured with carbon fibers and a resin, where the fibers are aligned in a specific direction to achieve a high flexural modulus of 45 GPa or more, and a lightweight design with a warpage of less than 0.5 mm, using a layered configuration and 3D printing to minimize material loss and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional holding tools are used for semiconductor wafer processing, then the basic holding function is provided, but the mechanical strength is insufficient leading to scratches and wear during polishing
Solution Approach 1:
The holding tool is constructed as a composite material structure consisting of a fiber reinforcement layer (providing high mechanical strength and stiffness) and a resin matrix layer (providing binding and surface properties). This composite structure enables the tool to withstand polishing forces without deforming or damaging the semiconductor wafer, directly resolving the contradiction between mechanical strength and scratch prevention.
Solution Approach 2:
The fiber reinforcement layer is strategically positioned and oriented (with fibers extending in the circumferential direction) to provide localized strength where it is most needed during polishing operations. This localized reinforcement prevents scratches and wear at critical contact points while maintaining the overall structural integrity of the holding tool.
2Manufacturing precision
If conventional holding tools are used, then the basic structural requirements are met, but the flexural modulus is insufficient for precise substrate handling
Solution Approach 1:
The composite structure with fiber reinforcement provides high flexural modulus (resistance to bending) while maintaining a relatively thin profile. This enables precise substrate handling and positioning without excessive tool deflection during semiconductor processing operations, directly addressing the contradiction between manufacturing precision and flexural strength.
Solution Approach 2:
By changing the material parameters (introducing fiber reinforcement with specific orientation and density), the flexural modulus of the holding tool is significantly enhanced. This parameter change allows the tool to maintain precise geometric relationships during substrate handling while keeping the overall structure lightweight and manageable.
3Weight of moving object
If lightweight materials are used for the holding tool, then the load during conveyance is reduced, but the mechanical strength and electrostatic control may be compromised
Solution Approach 1:
The composite material structure achieves a high strength-to-weight ratio by combining lightweight resin matrix with high-strength fiber reinforcement. This allows the holding tool to be lightweight for easy conveyance while simultaneously providing sufficient mechanical strength and, when appropriate fibers (such as conductive or dissipative fibers) are used, electrostatic control capabilities to prevent charging issues during semiconductor processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a holding tool with enhanced mechanical strength, reduced electrostatic charging, and improved accuracy during semiconductor processing, minimizing scratches and wear, and reducing the load during substrate conveyance.
Implementation Method 1
a holding tool configured using carbon fibers and a resin, wherein the holding tool: has a substantially annular shape; is equipped with a substrate holding portion; and is equipped with a first resin layer, and in the first resin layer, a longitudinal direction of the fibers is aligned along a circumferential direction of the substantially annular shape
Implementation Method 2
The present invention proposes a holding tool configured using carbon fibers and a resin, wherein the holding tool: has a substantially annular shape; is equipped with a substrate holding portion; and is equipped with a first resin layer, and in the first resin layer, a longitudinal direction of the fibers is aligned along a circumferential direction of the substantially annular shape
Implementation Method 3
A holding tool configured using carbon fibers and a resin, wherein the holding tool: has a substantially annular shape; is equipped with a substrate holding portion; and is equipped with a first resin layer, and in the first resin layer, a longitudinal direction of the fibers is aligned along a circumferential direction of the substantially annular shape
Data Source
AI summary
Proposed is a holding tool that satisfies physical properties of a flexural modulus in a circumferential direction of 50 GPa or more and a warpage of not more than 0.5 mm. The holding tool is configured using carbon fibers and a resin, has a substantially annular shape, and includes a first resin layer. In the first resin layer, the longitudinal direction of the fibers is aligned along the circumferential direction of the substantially annular shape.