Flowable Carbon Gap Fill With Dual-Flowability Plasma Planarization
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Solution Overview
Problem
Traditional methods for filling gaps in semiconductor devices with flowable carbon material, such as spin-on carbon (SOC), face challenges in creating smooth and planar surfaces, especially in multiple-trench structures, leading to undesirable roughness and increased costs due to additional processing equipment and steps.
Innovation Solution
A method involving the formation of two carbon layers with different initial flowabilities, where the second layer has greater flowability than the first, treated with distinct plasma processes to achieve a smooth surface without voids, using a system with controlled plasma power and ion energy levels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional deposition techniques are used to fill gaps with carbon material, then the filling capability is achieved, but the surface roughness increases and planarization is poor
Solution Approach 1:
The patent divides the single carbon layer deposition process into multiple sequential deposition steps, creating a multi-layer carbon structure. Each layer is deposited with controlled thickness and properties, allowing the composite structure to achieve both gap filling and surface planarization that a single layer cannot accomplish
Solution Approach 2:
The patent creates a composite carbon layer structure where multiple carbon layers with different properties are combined. The composite structure leverages the advantages of each individual layer to achieve superior surface planarization and reduced roughness compared to traditional single-layer deposition
2Manufacturing precision
If spin-on carbon (SOC) process is used to fill gaps, then the flowable carbon material provides good filling capability, but additional processing equipment and steps are required
Solution Approach 1:
The patent extracts and eliminates the need for separate spin-coating equipment and SOC processing steps by implementing a direct deposition method that achieves the same gap filling capability using standard deposition equipment already present in the fabrication process
Solution Approach 2:
The patent makes the deposition equipment multi-functional by enabling it to perform both gap filling and surface planarization in a single process sequence, eliminating the need for separate SOC coating and baking equipment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method provides a flat, smooth surface in multiple-trench structures with reduced critical dimension variation and line edge roughness, eliminating the need for additional processing steps and equipment.
Implementation Method 1
treated with distinct plasma processes to achieve a smooth surface without voids
Data Source
AI summary
Methods and systems for forming a structure including multiple carbon layers and structures formed using the methods or systems are disclosed. Exemplary methods include forming a first carbon layer with an initial first flowability and a second carbon layer with an initial second flowability, wherein first flowability is less than second flowability.