Carbon Heat-Dissipating Part for Semiconductor Package Thermal Management

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Solution Overview

Problem

Highly integrated semiconductor devices face challenges in fabrication due to reduced photolithograph process margins, necessitating innovative solutions for increased integration density and performance.

Innovation Solution

A semiconductor package incorporating a substrate with a ground circuit, semiconductor chips, and a carbon-containing heat-dissipating part, which includes carbon fibers or carbon cloth, electrically connected to the ground circuit, and optionally a second heat-dissipating part made of metal or graphite, to enhance heat dissipation and reduce thermal expansion issues.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If higher integration of semiconductor devices is pursued, then integration density and performance are improved, but fabrication difficulties increase due to reduced photolithograph process margins

Engineering Contradiction:

Improveintegration densityVSAvoidphotolithograph process margin

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The semiconductor device is divided into multiple packages, each containing fewer chips, which are then stacked vertically. This segmentation allows each package to be fabricated with standard photolithography processes while achieving high integration density through the stacked configuration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention transitions from planar integration to three-dimensional stacking. By arranging packages vertically in multiple layers, the device achieves high integration density without requiring smaller feature sizes, thus avoiding photolithography process limitations.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Productivity

If more chips are integrated into a single package, then integration density is improved, but heat dissipation becomes more difficult

Engineering Contradiction:

Improveintegration densityVSAvoidheat dissipation

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The device is segmented into multiple packages with fewer chips each, stacked vertically. This distributes the heat-generating chips across multiple packages, improving heat dissipation by reducing thermal density in any single package.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Heat dissipation parts made of carbon fiber or carbon cloth are introduced as intermediary components between the chips and the external environment. These materials provide efficient thermal conduction pathways while being electrically insulating, effectively mediating heat transfer.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Temperature

If traditional heat dissipation materials are used, then heat dissipation is achieved, but warpage occurs due to thermal expansion mismatch

Engineering Contradiction:

Improveheat dissipationVSAvoidwarpage

Core Design Contradiction:

TemperatureVSStability of the object's composition

Solution Approach 1:

The invention changes the material parameter of heat dissipation components from traditional metals to carbon fiber or carbon cloth. These carbon-based materials have thermal expansion coefficients that better match semiconductor chips, reducing warpage while maintaining effective heat dissipation.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

Carbon fiber and carbon cloth are used as composite materials that combine electrical insulation properties with thermal conduction capabilities and compatible thermal expansion characteristics, simultaneously addressing heat dissipation and warpage issues.

Inventive Principle:

Principle #40Composite materials

4Temperature

If heat dissipation parts are added to improve thermal management, then heat dissipation is improved, but package thickness increases

Engineering Contradiction:

Improveheat dissipationVSAvoidpackage thickness

Core Design Contradiction:

TemperatureVSLength of moving object

Solution Approach 1:

Carbon cloth and carbon fiber are used in thin film or mat forms that provide effective heat dissipation with minimal thickness. These flexible carbon-based structures can be integrated into the package without significantly increasing the overall package thickness.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution improves heat-dissipation efficiency and shielding characteristics, reduces warpage, and allows for thinner semiconductor packages by utilizing carbon-containing materials with low thermal expansion coefficients, thereby addressing the challenges of high integration density and performance.

Implementation Method 1

a carbon-containing heat-dissipating part disposed on the substrate and electrically connected to the ground circuit

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

utilizing carbon-containing materials with low thermal expansion coefficients, thereby addressing the challenges of high integration density and performance

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS9029989B2Semiconductor package and semiconductor devices with the same

Publication Date: 2015.05.12 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor package includes a substrate, a ground circuit supported by the substrate, at least one semiconductor chip disposed on the substrate and a carbon-containing heat-dissipating part disposed on the substrate and electrically connected to the ground circuit. The heat-dissipating part may include carbon fibers and/or carbon cloth.