Selective Carbon Layer Patterning for Nanoscale Interconnects
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Solution Overview
Problem
In the context of nanoscale semiconductor device integration, existing methods face challenges with misalignment and overlay issues during the photolithography process for forming nano-scale wirings, which can be addressed by developing a method to selectively form a carbon layer with specific surface properties.
Innovation Solution
The method involves forming a carbon layer with an sp2 bonding structure on a hydrophobic surface of one material layer and a hydrophilic surface of another, using surface treatment layers as self-assembled monolayers, and depositing or transferring graphene or graphene quantum dots, which acts as a mask for subsequent material deposition, thereby enhancing surface energy differences and enabling precise patterning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography process is used for nano-patterning, then wiring pattern can be formed, but misalignment or overlay issues occur
Solution Approach 1:
Surface treatment layers are formed in advance on material layers before carbon layer deposition, creating predetermined hydrophobic/hydrophilic regions that guide subsequent selective carbon layer formation. This preliminary surface modification enables precise patterning without relying solely on photolithography alignment, thereby resolving overlay accuracy issues.
Solution Approach 2:
Different surface treatment layers are applied to different material layers to create localized hydrophobic or hydrophilic surfaces. This local differentiation allows selective carbon layer deposition on specific regions, improving manufacturing precision by enabling precise spatial control of carbon layer formation independent of photolithography alignment.
2Manufacturing precision
If carbon layer is formed on hydrophobic surface, then selective deposition is achieved, but surface treatment complexity increases
Solution Approach 1:
Surface treatment layers automatically create hydrophobic or hydrophilic surfaces that inherently guide carbon layer deposition without requiring additional control mechanisms. The surface treatment layers self-organize to provide the necessary surface energy differences, enabling selective carbon layer formation while simplifying the overall process control.
3Reliability
If surface treatment layer is formed as self-assembled monolayer, then hydrophobic/hydrophilic surface is created, but additional process steps are required
Solution Approach 1:
Self-assembled monolayer surface treatment layers automatically form the required hydrophobic or hydrophilic surfaces through self-organization, eliminating the need for complex external control mechanisms. The molecules spontaneously arrange themselves to create the desired surface energy characteristics, ensuring reliable surface properties while minimizing additional process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the selective formation of a carbon layer with low surface energy, facilitating precise patterning and reducing electrical resistance, while acting as a stable mask during high-temperature processes, thus improving the integration of nanoscale interconnects and enhancing electromigration resistance.
Implementation Method 1
forming a hydrophobic surface treatment layer on one of the first material layer and the second material layer
Implementation Method 2
forming a hydrophilic surface treatment layer on an other of the first material layer and the second material layer
Implementation Method 3
a carbon layer may be deposited formed on at least one of the first material layer and the second material layer selectively
Data Source
Figure 1~2
Figure 3~4A
Figure 4B~4C
AI summary
Provided are a method of forming a carbon layer and a method of forming an interconnect structure. The method of forming a carbon layer includes providing a substrate including first and second material layers, forming a surface treatment layer on at least one of the first and second material layers, and selectively forming a carbon layer on one of the first material layer and the second material layer. The carbon layer has an sp2 bonding structure.