Carbon Insertion Liner for Low-Resistance Semiconductor Contacts
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Solution Overview
Problem
As semiconductor devices shrink in size, the proportion of device occupied by contacts increases, leading to higher total resistance and reduced performance and reliability.
Innovation Solution
Incorporating a carbon insertion liner between the conductive connection structure and wiring structure in semiconductor devices to reduce interface resistance and oxidation, thereby improving performance and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the device size is reduced to increase integration, then the area occupied by contacts increases proportionally, but the total resistance increases and performance deteriorates
Solution Approach 1:
The patent applies local quality by introducing a carbon insertion liner specifically at the contact interface region where oxidation occurs, rather than uniformly treating the entire device. This localized intervention reduces interface resistance at the critical contact point while maintaining the overall device scaling benefits
Solution Approach 2:
The carbon insertion liner acts as an intermediary layer between the conductive connection structure and the wiring structure. This intermediate carbon layer prevents direct oxidation of the conductive material and reduces interface resistance, thereby maintaining reliable electrical connection despite device scaling
2Area of stationary object
If the device size is reduced to increase integration, then more components fit in smaller area, but the contact resistance increases due to oxidation
Solution Approach 1:
The carbon insertion liner is deposited in advance before the wiring structure is formed, creating a protective barrier that prevents oxidation of the conductive connection structure. This preliminary protective action occurs during the manufacturing process, preventing oxidation before it can occur during subsequent processing or device operation
Solution Approach 2:
The patent uses composite material structure by combining carbon with the conductive connection structure. The carbon insertion liner forms a composite interface between the conductive material and the surrounding environment, providing both electrical conductivity and oxidation resistance through the carbon layer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The carbon insertion liner effectively reduces interface resistance and oxidation, enhancing the performance and reliability of semiconductor devices by minimizing the increase in resistance due to the shrinking size of the devices.
Implementation Method 1
the insertion liner including carbon... effectively reduces interface resistance and oxidation
Implementation Method 2
the insertion liner including carbon... effectively reduces interface resistance
Data Source
AI summary
A semiconductor device includes a first interlayer insulating film; a conductive connection structure provided in the first interlayer insulating film; a second interlayer insulating film provided on the first interlayer insulating film; a wiring structure provided in the second interlayer insulating film and connected to the conductive connection structure; and an insertion liner interposed between an upper surface of the conductive connection structure and the wiring structure, the insertion liner including carbon.