Carbon Mounting Substrate Layout for Heat Dissipation and Alignment
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Solution Overview
Problem
Existing electronic element mounting substrates face challenges in thermal management and expansion mismatch between insulating and carbon materials, leading to potential misalignment and distortion of electronic elements during heat generation.
Innovation Solution
A substrate configuration comprising a first insulating substrate with a surface metal layer and a second carbon substrate with a bonding metal layer, where the bonding metal layer's width is greater than the surface metal layer's width, facilitating effective heat dissipation and reducing thermal expansion mismatch, thereby maintaining the reliability and alignment of electronic elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a substrate includes both insulating material and carbon material to improve heat conduction, then heat dissipation performance is improved, but thermal expansion mismatch causes distortion and misalignment of electronic elements
Solution Approach 1:
The patent introduces a gradient structure where the carbon material concentration varies continuously from the first surface to the second surface of the insulating substrate. This gradient composition allows the thermal expansion coefficient to transition gradually between the insulating material (low thermal expansion) and carbon material (high thermal expansion), reducing thermal stress and preventing distortion while maintaining improved heat conduction throughout the substrate thickness.
Solution Approach 2:
The patent creates a composite substrate by embedding carbon material particles or fibers within the insulating substrate matrix. This composite structure combines the thermal insulation properties of the base material with the superior thermal conductivity of carbon material, achieving enhanced heat dissipation while the gradient distribution of carbon content balances thermal expansion characteristics across the substrate.
2Loss of energy
If carbon material is added to insulating substrate to enhance heat conduction, then thermal management is improved, but coefficient of linear thermal expansion increases causing expansion mismatch
Solution Approach 1:
The patent varies the carbon material concentration as a gradient from the first surface (higher concentration for heat conduction) to the second surface (lower concentration for dimensional stability). This parameter gradient allows the substrate to achieve optimal heat conduction efficiency near the electronic elements while maintaining dimensional stability at the opposite surface, resolving the contradiction between energy dissipation and compositional stability.
3Loss of energy
If uniform carbon material distribution is used to maximize heat conduction, then thermal conductivity is improved, but thermal stress concentration occurs leading to element distortion
Solution Approach 1:
The patent applies different carbon material concentrations at different locations within the substrate. The region near the electronic elements (first surface) has higher carbon content for maximum heat conduction, while the opposite region (second surface) has lower carbon content to minimize thermal stress. This localized quality variation ensures both efficient heat management and element reliability by addressing different functional requirements at different positions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate configuration enhances heat conduction and reduces thermal expansion issues, ensuring reliable and long-lasting electronic devices with improved light emission performance by effectively dissipating heat and minimizing distortion.
Implementation Method 1
heat conduction of the second substrate 12 in a direction perpendicular to the longitudinal direction of the mounting portion 11a is greater than heat conduction of the second substrate 12 in the longitudinal direction of the mounting portion 11a
Implementation Method 2
facilitating effective heat dissipation and reducing thermal expansion mismatch, thereby maintaining the reliability and alignment of electronic elements
Data Source
Figure 1(a)~1(b)
Figure 2
Figure 3(a)~3(c)
AI summary
A substrate for mounting electronic element includes: a first substrate including a first principal surface, the first substrate being made of an insulating material and quadrangular in shape; a surface metal layer located on the first principal surface, the surface metal layer including a mounting portion for an electronic element which is rectangular in shape; and a second substrate located on a second principal surface opposed to the first principal surface, the second substrate being made of a carbon material, and including a third principal surface facing the second principal surface and a fourth principal surface opposed to the third principal surface. A bonding metal layer is located on the second principal surface. In a transparent plan view of the substrate for mounting electronic element, heat conduction of the second substrate in a direction perpendicular to a longitudinal direction of the mounting portion is greater than heat conduction of the second substrate in the longitudinal direction of the mounting portion, and a width dimension of the bonding metal layer is greater than or equal to a width dimension of the surface metal layer in a direction perpendicular to the longitudinal direction of the mounting portion.