Carbon Substrate Layout for Heat Dissipation Without Element Distortion
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Solution Overview
Problem
Current substrates for mounting electronic elements face challenges in efficiently dissipating heat generated by electronic elements, particularly in the longitudinal direction, which can lead to expansion and distortion issues, affecting the reliability and performance of electronic devices.
Innovation Solution
A substrate configuration comprising a first insulating substrate, a second substrate with a frame shape, and a third carbon substrate with varying thermal conductivity in different directions, where the third substrate is embedded within the second substrate, allowing for enhanced heat dissipation perpendicular to the electronic element's longitudinal direction, thereby reducing expansion and distortion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation is enhanced in the longitudinal direction of the mounting portion, then heat removal efficiency is improved, but the electronic element experiences expansion and distortion that reduces reliability
Solution Approach 1:
The patent applies local quality by creating anisotropic heat conduction in the third substrate, where thermal conductivity is specifically enhanced in the direction perpendicular to the longitudinal direction of the mounting portion. This directional differentiation allows heat to be dissipated effectively without causing expansion and distortion in the longitudinal direction, thus resolving the contradiction between heat dissipation efficiency and electronic element stability
Solution Approach 2:
The patent employs a composite substrate structure consisting of multiple layers with different materials: an insulating first substrate, a frame-shaped second substrate, and a carbon-based third substrate. The carbon material in the third substrate provides high thermal conductivity in specific directions, while the overall composite structure maintains dimensional stability, thereby achieving both effective heat dissipation and reliability
2Ease of manufacture
If a simple single-layer substrate structure is used, then manufacturing complexity is reduced, but heat dissipation performance is insufficient
Solution Approach 1:
The patent segments the substrate into three distinct functional layers: an insulating first substrate for electrical isolation, a frame-shaped second substrate for structural support, and a carbon-based third substrate for targeted heat dissipation. This segmentation allows each layer to perform its specific function optimally, achieving superior heat dissipation performance while maintaining manufacturability through modular construction
Solution Approach 2:
The patent implements a nested structure where the frame-shaped second substrate is positioned within the first substrate, and the third substrate is embedded within the second substrate. This nested arrangement allows multiple functional layers to be integrated in a compact configuration, enhancing heat dissipation performance without significantly increasing manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat away from the electronic element, reducing its expansion and distortion, thereby improving the reliability and performance of electronic devices, especially in high-power applications like optical devices.
Implementation Method 1
The third substrate has a larger heat conduction in a direction perpendicular to the longitudinal direction of the mounting portion than heat conduction in the longitudinal direction of the mounting portion in plan view
Data Source
AI summary
A first substrate includes a first surface and a second surface opposite to the first surface. A second substrate includes a third surface and a fourth surface opposite to the third surface. A third substrate includes a fifth surface and a sixth surface opposite to the fifth surface. The first substrate is made of an insulator, and includes a mounting portion for mounting an electronic element at the first surface, and the mounting portion is a rectangular shape. The third substrate is made of a carbon material, and the fifth surface is connected to at least the second surface at location overlapped with the mounting portion in plan view. The third substrate has a larger heat conduction in a direction perpendicular to the longitudinal direction of the mounting portion than heat conduction in the longitudinal direction of the mounting portion in plan view.