Carbon Substrate Microchannel Chip for Chemical Resistance

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Solution Overview

Problem

Conventional glass microchannel chips are costly to process and have poor chemical resistance, limiting their efficiency and applicability in microreactor systems.

Innovation Solution

A microchannel chip is fabricated using a carbon substrate, such as graphite or amorphous carbon, bonded to a glass cover without adhesives, utilizing laser radiation to form strong and chemically resistant microchannels at a lower cost.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If glass is used as substrate material for microchannel chips, then chemical resistance is improved, but manufacturing cost increases and processing difficulty increases

Engineering Contradiction:
Improvechemical resistanceVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The invention uses a composite structure combining carbon substrate with glass cover. The carbon substrate provides chemical resistance and heat conductivity, while the glass cover provides transparency and chemical resistance. This composite approach allows each material to contribute its advantageous properties while mitigating their individual disadvantages.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The invention replaces expensive glass substrates with carbon substrates that can be manufactured at lower cost. The carbon substrate maintains durability and chemical resistance while reducing manufacturing complexity and cost, effectively using a more economical material that performs the required function.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

2Reliability

If glass is used as substrate material for microchannel chips, then chemical resistance is improved, but processing complexity increases

Engineering Contradiction:
Improvechemical resistanceVSAvoidprocessing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The invention replaces complex glass processing techniques with carbon-based processing methods. Carbon substrates allow for simpler manufacturing processes while maintaining chemical resistance, reducing the complexity of microchannel formation and device fabrication.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention changes the material parameter from glass to carbon for the substrate. This parameter change fundamentally alters the processing requirements, allowing for simpler manufacturing while maintaining or improving chemical resistance properties.

Inventive Principle:
Principle #35Parameter changes

3Strength

If adhesive is used to bond cover glass to substrate, then bonding strength is improved, but chemical resistance deteriorates due to adhesive leakage

Engineering Contradiction:
Improvebonding strengthVSAvoidchemical resistance
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The invention removes the adhesive layer from the bonding interface between the cover glass and substrate. By eliminating the adhesive, the system achieves both strong bonding and complete chemical resistance, as there is no adhesive material that could leak or degrade under chemical exposure.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention uses direct contact and friction-based bonding as the intermediary mechanism between the cover glass and substrate, eliminating the need for chemical adhesives. This intermediary approach provides sufficient bonding strength while maintaining chemical integrity.

Inventive Principle:
Principle #24Intermediary (Mediator)

4Ease of manufacture

If carbon substrate is used instead of glass, then manufacturing cost is reduced and heat conductivity is improved, but bonding difficulty increases

Engineering Contradiction:
Improvemanufacturing costVSAvoidbonding difficulty
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The invention replaces complex bonding techniques with friction-based mechanical bonding. The carbon substrate is bonded to the glass cover through friction and contact pressure, eliminating the need for adhesives or complex bonding mechanisms while achieving reliable attachment.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The carbon-based microchannel chip offers improved chemical resistance, heat conductivity, and stability, reducing the risk of adhesive leakage and enabling efficient chemical reactions at a lower production cost, making it suitable for various microreactor applications.

Implementation Method 1

heating the contact site with laser radiation or the like in the state wherein the carbon substrate and the glass are in contact with each other

Methodology Applied
Scientific EffectLaser radiation heating: Laser

Implementation Method 2

heating at least a part of the contact surface at which the substrate is in contact with the cover to bond the glass plate to the substrate

Methodology Applied
Scientific EffectThermal bonding: Heating

Data Source

PatentEP2168673B1A method of producing a micro-passage chip
Publication Date: 2022.04.13 HIPEP LAB
  • EP2168673B1 patent drawingFigure 1~2

AI summary

Means for overcoming the problems which the conventional glass microchannel chips have are disclosed. That is, a microchannel chip in which microchannels can be formed at a low cost, and which has a high chemical resistance is disclosed. The microchannel chip is constituted by a substrate made of carbon, which has a channel in its surface; and a cover composed of a glass plate bonded to the substrate. The cover is bonded to the substrate by heating at least a part of the contact surface at which the substrate is in contact with the cover.