Carbon Substrate Microchannel Chip for Chemical Resistance
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Solution Overview
Problem
Conventional glass microchannel chips are costly to process and have poor chemical resistance, limiting their efficiency and applicability in microreactor systems.
Innovation Solution
A microchannel chip is fabricated using a carbon substrate, such as graphite or amorphous carbon, bonded to a glass cover without adhesives, utilizing laser radiation to form strong and chemically resistant microchannels at a lower cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass is used as substrate material for microchannel chips, then chemical resistance is improved, but manufacturing cost increases and processing difficulty increases
Solution Approach 1:
The invention uses a composite structure combining carbon substrate with glass cover. The carbon substrate provides chemical resistance and heat conductivity, while the glass cover provides transparency and chemical resistance. This composite approach allows each material to contribute its advantageous properties while mitigating their individual disadvantages.
Solution Approach 2:
The invention replaces expensive glass substrates with carbon substrates that can be manufactured at lower cost. The carbon substrate maintains durability and chemical resistance while reducing manufacturing complexity and cost, effectively using a more economical material that performs the required function.
2Reliability
If glass is used as substrate material for microchannel chips, then chemical resistance is improved, but processing complexity increases
Solution Approach 1:
The invention replaces complex glass processing techniques with carbon-based processing methods. Carbon substrates allow for simpler manufacturing processes while maintaining chemical resistance, reducing the complexity of microchannel formation and device fabrication.
Solution Approach 2:
The invention changes the material parameter from glass to carbon for the substrate. This parameter change fundamentally alters the processing requirements, allowing for simpler manufacturing while maintaining or improving chemical resistance properties.
3Strength
If adhesive is used to bond cover glass to substrate, then bonding strength is improved, but chemical resistance deteriorates due to adhesive leakage
Solution Approach 1:
The invention removes the adhesive layer from the bonding interface between the cover glass and substrate. By eliminating the adhesive, the system achieves both strong bonding and complete chemical resistance, as there is no adhesive material that could leak or degrade under chemical exposure.
Solution Approach 2:
The invention uses direct contact and friction-based bonding as the intermediary mechanism between the cover glass and substrate, eliminating the need for chemical adhesives. This intermediary approach provides sufficient bonding strength while maintaining chemical integrity.
4Ease of manufacture
If carbon substrate is used instead of glass, then manufacturing cost is reduced and heat conductivity is improved, but bonding difficulty increases
Solution Approach 1:
The invention replaces complex bonding techniques with friction-based mechanical bonding. The carbon substrate is bonded to the glass cover through friction and contact pressure, eliminating the need for adhesives or complex bonding mechanisms while achieving reliable attachment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The carbon-based microchannel chip offers improved chemical resistance, heat conductivity, and stability, reducing the risk of adhesive leakage and enabling efficient chemical reactions at a lower production cost, making it suitable for various microreactor applications.
Implementation Method 1
heating the contact site with laser radiation or the like in the state wherein the carbon substrate and the glass are in contact with each other
Implementation Method 2
heating at least a part of the contact surface at which the substrate is in contact with the cover to bond the glass plate to the substrate
Data Source
Figure 1~2
AI summary
Means for overcoming the problems which the conventional glass microchannel chips have are disclosed. That is, a microchannel chip in which microchannels can be formed at a low cost, and which has a high chemical resistance is disclosed. The microchannel chip is constituted by a substrate made of carbon, which has a channel in its surface; and a cover composed of a glass plate bonded to the substrate. The cover is bonded to the substrate by heating at least a part of the contact surface at which the substrate is in contact with the cover.