Carbon Waterblock with Oriented Grains for Heat Dissipation
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Solution Overview
Problem
Modern semiconductors face increased thermal loads due to higher power densities and frequencies, leading to challenges in cooling solutions, particularly in achieving uniform temperature distribution and efficient heat dissipation in consumer electronics, where liquid cooling systems have not gained general acceptance due to risks, cost, and complexity.
Innovation Solution
A carbon-based waterblock with vertically oriented grains and machined notches for enhanced thermal conductivity, combined with a microchannel system and a mesh-based radiator for efficient heat transfer, forming a self-contained, sealed cooling device that utilizes centrifugal flow and hierarchical channel networks for effective heat removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If copper or silver waterblocks are used for thermal interface, then thermal conductivity is improved, but cost and weight increase
Solution Approach 1:
The patent uses carbon fiber reinforced polymer composite material for the waterblock, combining the high thermal conductivity of carbon fiber with the structural properties of polymer. This composite approach achieves thermal performance comparable to copper or silver while significantly reducing weight and cost.
Solution Approach 2:
The patent employs carbon fiber reinforced polymer, a relatively inexpensive material compared to copper or silver, making high-performance thermal interface solutions accessible for mainstream consumer electronics rather than just specialty applications.
2Temperature
If carbon nanotubes are used for thermal interface, then thermal conductivity is improved, but manufacturing complexity increases
Solution Approach 1:
The patent utilizes the inherent high thermal conductivity parameter of carbon fiber reinforced polymer material to achieve effective heat dissipation without requiring complex nanotube alignment or specialized manufacturing processes.
Solution Approach 2:
The patent incorporates cooling channels and fins strategically positioned in high-heat-generation areas of the semiconductor device, concentrating cooling efficiency where it is most needed rather than uniformly distributing complex manufacturing features throughout the entire waterblock.
3Productivity
If liquid cooling systems are implemented, then heat dissipation efficiency is improved, but system complexity and risk increase
Solution Approach 1:
The patent integrates the waterblock directly with the semiconductor device housing, merging the cooling function with the structural enclosure. This integration eliminates separate cooling components and reduces overall system complexity while maintaining effective liquid cooling performance.
Solution Approach 2:
The carbon fiber reinforced polymer waterblock serves multiple functions simultaneously: it provides thermal conduction from the semiconductor, structural support for the device, and houses the cooling channels. This multi-functionality reduces the number of separate components needed in the cooling system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The carbon-based cooling system achieves optimized heat transfer, scalable design, cost-effectiveness, and reduced material usage while maintaining high thermal efficiency and preventing coolant corrosion, addressing the limitations of existing cooling technologies.
Implementation Method 1
Carbon is used for the construction of a water-block of a fluid cooling device, which serves as the interface between the semiconductor surface and the actual heat spreader or cooler
Implementation Method 2
a mesh-based radiator for efficient heat transfer, forming a self-contained, sealed cooling device
Implementation Method 3
dissipates the thermal energy to the environment
Data Source
AI summary
A liquid cooling block consisting essentially of carbon for use with electric devices generating heat, comprising in combination; the cooling block contains grain in substantially normal orientation to the heat transfer surface between the cooling block and the electric device; a chamber with a bottom wall having prismatic projections for surface increase; the coolant is injected into the center of the cooling chamber and moves centrifugally towards block outlet channels in heat transfer relation with said projections; and, wherein the cooling block communicates with a cooler receiving coolant from the outlet channels of the liquid cooling block.