Card Connector Conductor Arrangement for High-Speed Signal Integrity
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Solution Overview
Problem
The increasing number of terminals in high-speed SD cards leads to mutual interference issues, capacitive effects, and electromagnetic radiation interference, which affect their high-frequency performance.
Innovation Solution
A card connector design featuring a transmission conductor assembly with strategically arranged soldering and spring sections to reduce capacitive effects and suppress electromagnetic radiation interference, including specific configurations for differential and grounding conductors to improve high-frequency performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the number of terminals in SD card is increased to support high-speed data transmission, then data transmission rate is improved, but mutual interference and capacitive effect between terminal sets increases
Solution Approach 1:
The terminal sets are divided into multiple groups with each group containing signal terminals and grounding terminals. The grounding terminals are segmented and distributed between different terminal sets to isolate the signal terminals from each other, reducing capacitive coupling effects while maintaining high data transmission rates.
Solution Approach 2:
Grounding terminals are introduced as intermediary elements between signal terminals. These grounding terminals act as shields that reduce the capacitive effect and mutual interference between adjacent signal terminal sets, enabling high-speed data transmission without excessive interference.
2Area of stationary object
If terminal sets are arranged closely to fit multiple terminals in small SD card, then device compactness is improved, but electromagnetic radiation interference increases
Solution Approach 1:
Different terminal sets are assigned different local qualities - signal terminals for data transmission and grounding terminals for electromagnetic shielding. The grounding terminals are strategically positioned between signal terminals to create local electromagnetic shields, reducing radiation interference while maintaining compact form factor.
Solution Approach 2:
The grounding terminals, which occupy additional space, are converted into beneficial electromagnetic shields. By introducing these grounding elements, the compact design actually achieves better electromagnetic compatibility than a simpler design without grounding terminals, as the grounding terminals suppress electromagnetic radiation interference.
3Reliability
If grounding terminals are added between signal terminals to reduce capacitive effect, then high frequency performance is improved, but device complexity increases
Solution Approach 1:
The grounding terminals serve multiple functions simultaneously: they reduce capacitive coupling between signal terminals, provide electromagnetic shielding, and establish reference potential levels. This multi-functionality allows the grounding terminals to improve high-frequency performance without proportionally increasing device complexity, as a single element type performs multiple protective functions.
Data Source
AI summary
A card connector includes a transmission conductor assembly. The transmission conductor assembly includes a first conductor group and a second conductor group. The first conductor group includes a backup transmission conductor, first and second signal transmission conductors, an inspection signal transmission conductor, first to seventh grounding transmission conductors, a command reset transmission conductor, first to sixth differential transmission conductors, first and second power transmission conductors, and a write-protection transmission conductor, each of which has two ends respectively forming a spring section and a soldering section. The second conductor group includes eighth to tenth grounding transmission conductors, seventh to tenth differential transmission conductors, and a third power transmission conductor each of which has two ends respectively forming a spring section and a soldering section. The soldering sections, being so arranged, achieve advantages of bettering high frequency performance, reducing capacitive effect, and suppressing electromagnetic radiation interference.


