Card-Edge Connector Busbar Layout for High-Current PCB Power
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electrical connectors for high-power applications face limitations in current capacity due to high current density near the connector, which can increase manufacturing costs, size, and complexity when additional power is required, especially in scenarios where components are upgraded or designed for future high-current demands.
Innovation Solution
A card-edge connector system with a busbar connection that allows for the distribution of power through both power planes and a conductive interconnect, such as a busbar, reducing current density near the connector by splitting the current flow to remote locations on the PCB, thereby enabling thinner and less costly PCB designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If additional power is required for high-current demands, then power capacity must be increased, but current density near the connector increases leading to increased manufacturing costs, size, and complexity
Solution Approach 1:
The connector is divided into multiple independent contact elements (e.g., 3-5 individual contacts) within the single card-edge connector interface. Each contact element can independently carry current, allowing the total current capacity to be distributed across multiple parallel paths rather than concentrating high current density in a single connector, thereby reducing thermal issues and manufacturing complexity while maintaining high power capacity
Solution Approach 2:
The invention transitions from a single-plane connector design to a three-dimensional contact arrangement where multiple contacts are stacked or arranged in different spatial dimensions within the same connector footprint. This vertical or multi-dimensional stacking allows high current capacity without increasing the horizontal connector size, effectively distributing current density across multiple spatial dimensions
2Power
If additional power is required for high-current demands, then power capacity must be increased, but PCB thickness and cost increase to handle higher current density
Solution Approach 1:
The high current path is segmented into multiple parallel current paths through the PCB, each carrying a portion of the total current. This is achieved by having multiple contact elements in the connector that connect to separate PCB traces or power planes, distributing the current load and allowing the use of thinner PCB material while still handling high total current
Solution Approach 2:
The invention introduces intermediate distribution points within the PCB structure, such as power planes or copper pours, that act as mediators to redistribute current from the connector to various load points. These intermediaries help manage current density by providing multiple local connection points, reducing the need for thick PCB traces and allowing thinner overall PCB design
3Adaptability or versatility
If components are designed for future high-current upgrades, then adaptability is improved, but manufacturing costs and complexity increase
Solution Approach 1:
The card-edge connector design incorporates a universal multi-contact interface that can accommodate different current requirements through software configuration or simple physical selection of contact usage. The same physical connector structure supports both low-current and high-current applications by enabling flexible allocation of its multiple contact elements, eliminating the need for different connector types for different power levels
Solution Approach 2:
The connector system enables dynamic reconfiguration of current paths through firmware or control logic that can activate or deactivate specific contact elements based on real-time power requirements. This dynamic adaptability allows the system to optimize current distribution for different operating conditions without requiring physical hardware changes, maintaining manufacturing simplicity while providing upgrade flexibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables higher power capacity without increasing current density, allowing for flexible upgrades and reduced manufacturing costs by distributing current through both power planes and busbars, thus supporting higher power requirements without thickening the PCB.
Implementation Method 1
A card-edge connector system with a busbar connection that allows for the distribution of power through both power planes and a conductive interconnect, such as a busbar, reducing current density near the connector by splitting the current flow to remote locations on the PCB
Data Source
AI summary
A connector that enables electronic assemblies to be efficiently configured for any of multiple power requirements. The connector may have multiple interfaces such that when the connector is mounted to a printed circuit board (PCB), it may receive power through an interface and distribute it to components on the PCB through another interface. The connector may also have an interface that supports a connection to a conductive interconnect, which may distribute power to a second connector mounted to the same PCB. Power may be distributed to components mounted to the PCB without passing through the mounting interface of the first connector. As a result, the current density in the PCB adjacent the first connector is reduced relative to current density required to supply current to all components through the mounting interface of the first connector. The PCB may have fewer layers than a conventional PCB assembly supporting comparable functionality.