Compact Card Edge Connector Layout for High-Speed PCB Density
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Solution Overview
Problem
Conventional electrical connectors struggle to accommodate multiple high-speed data channels while adhering to dimensional constraints, particularly in advanced electronic systems where data transmission rates exceed 10 Gigabit/sec and circuit density increases, leading to inefficiencies in signal transmission and PCB size limitations.
Innovation Solution
The development of compact electrical connectors with multiple types of wafers, where first wafers handle low-speed signals and second wafers handle high-speed signals, arranged in specific configurations to reduce footprint and enhance signal integrity, allowing for dual interfaces and efficient data transmission across multiple channels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional electrical connectors are used to accommodate multiple high-speed data channels, then data transmission capability is improved, but connector dimensions and PCB space requirements increase
Solution Approach 1:
The connector is divided into multiple wafers, with each wafer handling specific signal types (low-speed vs. high-speed). This segmentation allows for optimized space utilization and reduces the overall connector footprint while maintaining high data transmission capability through dedicated high-speed channels.
Solution Approach 2:
The patent transitions from a conventional two-column contact arrangement to a multi-wafer stacked configuration. By stacking wafers in the vertical dimension, the connector achieves higher channel density without proportionally increasing the horizontal footprint, effectively moving the solution into three-dimensional space.
2Productivity
If circuit density is increased to accommodate more channels, then data transmission rate is improved, but signal integrity deteriorates
Solution Approach 1:
By separating low-speed and high-speed signals into different wafers, the patent prevents signal interference between different signal types. Each wafer can be optimized for its specific signal requirements, maintaining signal integrity even as overall circuit density increases.
Solution Approach 2:
Each wafer is designed with specific local characteristics optimized for its function. High-speed wafers have optimized trace geometries, impedance control, and routing patterns specifically tailored for high-frequency signals, while low-speed wafers have different optimizations, ensuring each signal type maintains its integrity.
Data Source
AI summary
A compact card edge connector for providing high-speed interconnections between different components. The card edge connector includes a mating interface configured to receive a card, a second interface configured to mount to a printed circuit board, and a fourth interface configured to mate with a cable component. The mating interface is perpendicular to the second interface and parallel to the fourth interface. For each column of mating ends at the mating interface, the connector includes two rows mounting ends at the second interface and one column of mounting ends at the fourth interface.