Card Edge Connector Guide Spring for Precise PCB Contact Alignment
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Solution Overview
Problem
Existing card edge connectors face challenges in achieving precise contact guidance between printed circuit boards and electric contacts due to large manufacturing tolerances, leading to potential faulty connections and short-circuits, especially when contact spacing is less than 1 mm.
Innovation Solution
A pressing spring is integrated into the card edge connector, applying lateral pressure to the mating region of the printed circuit board or connector adapter, ensuring precise alignment and contact between contact decks and electric contacts by guiding the printed circuit board into a funnel-shaped slot with a lay-on region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the contact grid size is reduced to increase contact density, then the number of contacts per unit area increases, but manufacturing precision requirements increase significantly leading to higher costs and potential faulty connections
Solution Approach 1:
A guide spring is introduced as an intermediary component between the PCB contact decks and the connector contacts. The guide spring actively guides and positions the contact decks during insertion, compensating for manufacturing tolerances and enabling precise contact alignment even with reduced contact grid spacing without requiring increased manufacturing precision
Solution Approach 2:
The guide spring performs preliminary positioning and alignment of the contact decks before actual electrical contact is established. By pre-guiding the contact decks into the correct position during insertion, the system ensures accurate contact alignment before the contacts engage, allowing for smaller contact grids without compromising connection reliability
2Length of moving object
If contact spacing is reduced below 1 mm to increase integration density, then device miniaturization is achieved, but dimensional tolerances become difficult to control leading to faulty connections and short-circuits
Solution Approach 1:
The guide spring serves as a mechanical intermediary that actively compensates for dimensional tolerances when contact spacing is reduced. It provides real-time guidance and positioning during insertion, ensuring that even with small contact spacings and varying manufacturing tolerances, the contact decks align correctly with the contacts, preventing faulty connections and short-circuits
Solution Approach 2:
The system changes the mechanical parameters of the insertion process by introducing elastic deformation through the guide spring. The spring's elasticity allows it to adapt to dimensional variations and provide consistent guiding force, maintaining connection reliability despite reduced contact spacing and inherent manufacturing tolerances
3Manufacturing precision
If a separate metallic spring is used for the pressing spring, then precise contact guidance is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The pressing spring function is merged with the insulating member by integrally molding the spring into the insulating material. This combination eliminates the need for a separate metallic spring component, reducing assembly steps and structural complexity while maintaining the precise contact guidance function through the elastic properties of the molded-in spring
4Speed
If the printed circuit board is inserted without defined guidance, then insertion speed is increased, but contact alignment precision deteriorates leading to faulty connections
Solution Approach 1:
The guide spring performs preliminary guidance and positioning of the contact decks during the insertion process itself. As the PCB is inserted, the guide spring immediately engages and guides the contact decks into the correct position, enabling fast insertion without requiring pre-alignment or defined guidance paths, while still achieving precise contact alignment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution minimizes dimensional tolerances, preventing faulty connections and short-circuits by ensuring precise contact alignment, even with small contact spacings, and can be implemented without a separate metallic spring, using a spring molded into the insulating member.
Implementation Method 1
a pressing spring is arranged in the card edge connector and selectively subjects the mating region of the printed circuit board or the connector adapter to lateral pressure
Data Source
AI summary
Precise contact guidance of contact decks on a printed circuit board relative to the electric contacts in a card edge connector, is achieved using a pressing spring within the slot of the card edge connector in such a way that it mechanically deflects the mating region of the printed circuit board into a position in which a precisely fitted coincidence of the respective contacts is expected before the electric contacting takes place.