Card Inlet Structure for Precise Exposed Component Alignment
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Solution Overview
Problem
Existing smart cards face issues with inaccurate positioning of exposed components due to increased bonding points between the components and spacers, leading to potential connection failures.
Innovation Solution
An inlet design with a circuit board and sheet circuit board configuration, where the exposed components are bonded to the circuit board closer to the back surface and the sheet circuit board is closer to the front surface, allowing for accurate positioning through through holes, and includes biometric sensors and contactless communication functions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a spacer is provided to adjust the height of an exposed component, then the height adjustment is achieved, but the positioning accuracy of the exposed component decreases due to increased bonding points
Solution Approach 1:
The patent removes the spacer component entirely and replaces it with a recess structure formed directly in the card body. This extraction of the unnecessary spacer eliminates the multiple bonding points that caused positioning inaccuracies, while the recess structure achieves the same height adjustment function through a single integrated design.
Solution Approach 2:
The patent merges the height adjustment function previously performed by a separate spacer component into the card body structure itself through a recess. This consolidation eliminates the interface between spacer and exposed component, removing the source of positioning errors while maintaining the height adjustment capability.
2Length of stationary object
If a spacer is provided to adjust the height of an exposed component, then the height adjustment is achieved, but the risk of connection failure increases due to increased number of contacts
Solution Approach 1:
The patent extracts and removes the spacer component that introduced multiple contact points. By eliminating this intermediate component, the design reduces the number of contacts and bonding interfaces, thereby lowering the risk of connection failures while maintaining the necessary height adjustment through the recess structure.
3Manufacturing precision
If the exposed component is bonded directly to the circuit board, then the positioning accuracy is improved, but the height adjustment capability is lost
Solution Approach 1:
The patent segments the card body structure into two functional parts: a flat bonding surface for accurate positioning of the exposed component, and a recess structure that provides the necessary height adjustment. This segmentation allows both positioning accuracy and height adjustment to coexist without compromise.
Solution Approach 2:
The patent introduces a vertical dimension through the recess structure while maintaining horizontal positioning accuracy. The recess provides height adjustment in the Z-direction without affecting the X-Y plane positioning of the exposed component on the bonding surface, effectively solving both requirements simultaneously.
Data Source
AI summary
An inlet embedded in a card medium, the inlet including: an exposed component at least partially exposed on a front surface of the card medium; a circuit board including a board wiring part to which the exposed component is bonded on a front surface side, the circuit board being provided closer to a back surface of the card medium than the exposed component is; and a sheet circuit board provided closer to the front surface than the circuit board is, the sheet circuit board including a sheet wiring part electrically connected to the board wiring part on a back surface side, and a sheet including at least one sheet through hole through which the exposed component can pass.