Card Module Antenna Wiring With Intermediate Bond Pads
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Solution Overview
Problem
The manufacturing of electronic modules for cards and similar devices faces challenges with the height of connection wires between buried antennas and chips, as well as the connection of studs with bonding wells, often resulting in crossed or excessively long wires.
Innovation Solution
The introduction of intermediate connection studs arranged inside the antenna loop allows for shorter connection wires and prevents them from crossing, using materials like aluminum or gold threads for connections between the chip, antenna, and bonding wells.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection wires are used to link the antenna and chip directly, then electrical connection is achieved, but the wire height becomes excessive and wires may cross
Solution Approach 1:
The patent introduces intermediate connection pads as intermediary elements between the antenna and chip. These pads are positioned within the antenna loop structure and serve as intermediate connection points, allowing the connection wires to be divided into shorter segments (antenna to intermediate pad, and intermediate pad to chip) rather than requiring a single long wire, thus reducing the overall wire height and preventing crossings
Solution Approach 2:
The connection path is segmented by introducing intermediate pads that divide the direct antenna-chip connection into multiple shorter segments. The connection wires are split into portions connecting antenna to intermediate pad and intermediate pad to chip, reducing the height requirement and avoiding wire crossings through strategic positioning of these intermediate connection points
2Reliability
If chip connection pads are connected directly to bonding wells, then electrical connection is established, but connection wires become excessively long or cross each other
Solution Approach 1:
Intermediate connection pads serve as mediator elements between the chip connection pads and bonding wells. By positioning these intermediate pads strategically within the antenna loop, the patent creates intermediate connection points that simplify wire routing, reduce wire length, and prevent crossings between multiple connection wires
Solution Approach 2:
The intermediate pads are positioned within the antenna loop structure, utilizing the two-dimensional space of the antenna layout. This spatial arrangement allows wires to connect chip pads to bonding wells through intermediate points that are distributed across different locations, reducing the need for long crossing wires and simplifying the overall routing complexity
Data Source
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AI summary
An electronic module (2) and the manufacturing method thereof, the electronic module comprising a substrate (20) on which one or more electrically conductive tracks (21) are arranged, at least one integrated circuit (22) comprising several bond pads (22p), characterised in that it comprises: - at least one intermediate bond pad (25) located on at least one face of the substrate (20), - the intermediate bond pad (25) is connected at least - at a first point, to the electrically conductive tracks (21) or to a connection well at the substrate (20), by means of a first bonding wire (241), and - at a second point, to at least one pad of the integrated circuit (22), by means of a second bonding wire (242).